POLISHING APPARATUS AND POLISHING METHOD
    1.
    发明申请
    POLISHING APPARATUS AND POLISHING METHOD 审中-公开
    抛光装置和抛光方法

    公开(公告)号:US20110053461A1

    公开(公告)日:2011-03-03

    申请号:US12811934

    申请日:2008-12-15

    IPC分类号: B24B1/00 B24B7/00

    摘要: A plate material, while being transferred by a transfer mechanism, is sandwiched by two polishing heads. The plate material is transferred by the transfer mechanism while the two polishing heads are vibrated by a vibration mechanism in a direction crossing a transfer direction T of the plate material.

    摘要翻译: 通过转印机构转印的板材由两个抛光头夹持。 当两个抛光头在与板材的传送方向T交叉的方向上通过振动机构振动时,板材由传送机构传送。