公开(公告)号：US5723908A

公开(公告)日：1998-03-03

申请号：US208870

申请日：1994-03-11

申请人： Yumi Fuchida ,  Jun Hanari ,  Kazuhiro Matsumoto ,  Junichi Kudo ,  Kunio Yoshihara ,  Ayako Takagi

发明人： Yumi Fuchida ,  Jun Hanari ,  Kazuhiro Matsumoto ,  Junichi Kudo ,  Kunio Yoshihara ,  Ayako Takagi

IPC分类号： H01L23/528 ,  H05K1/00 ,  H05K1/02 ,  H01L23/48

CPC分类号： H01L23/5286 ,  H01L23/528 ,  H01L2224/48227 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0218 ,  H05K1/0298

摘要： A multilayer wiring structure comprising a substrate, two line layers, and an interlayer insulating film. The first line layer consists of strip-shaped power/ground lines which extend parallel to one another. The second line layer is located above or below the first line layer, extends substantially parallel to the first line layer. The second line layer consists of strip-shaped signal lines which extend parallel to one another and at an angle to the strip-shaped power/ground lines of the first line layer in a skewed position.

摘要翻译： 一种多层布线结构，包括基底，两个线层和层间绝缘膜。 第一线层由彼此平行延伸的带状电源/接地线组成。 第二线层位于第一线层之上或之下，基本平行于第一线层延伸。 第二线层由条状信号线组成，它们彼此平行地延伸并且在倾斜位置处与第一线路层的带状电力/接地线成角度地延伸。