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    ELECTRONIC DEVICE
    2.
    发明申请
    ELECTRONIC DEVICE 有权
    电子设备

    公开(公告)号：US20140355190A1

    公开(公告)日：2014-12-04

    申请号：US14079650

    申请日：2013-11-14

    申请人： Hsin Yeh ,  Yung-Hsiang Chen ,  Wei-Han Hu ,  Tzu-Chien Lai ,  Cho-Yao Yen

    发明人： Hsin Yeh ,  Yung-Hsiang Chen ,  Wei-Han Hu ,  Tzu-Chien Lai ,  Cho-Yao Yen

    IPC分类号： G06F1/16

    CPC分类号： G06F1/1669

    摘要： An electronic device including a first body and a second body is provided. The first body has a first connection end. The second body has a second connection end, in which the second connection end has a first magnetic component and a first convex arc surface, and the second body is detachably connected to the first body through a magnetic attractive force between the first magnetic component and the first connection end. The first body and the second body are configured to rotate around a rotation axis relatively to each other, and the first convex arc surface faces the first connection end and extends along a direction parallel to the rotation axis.

    摘要翻译： 提供了包括第一主体和第二主体的电子装置。 第一个主体有第一个连接端。 第二主体具有第二连接端，其中第二连接端具有第一磁性部件和第一凸起弧形表面，并且第二主体通过第一磁性部件和第一磁性部件之间的磁性吸引力可拆卸地连接到第一主体 第一连接端。 第一主体和第二主体被构造为围绕彼此相对旋转的轴线旋转，并且第一凸弧面面向第一连接端并沿着平行于旋转轴线的方向延伸。

    PORTABLE ELECTRONIC DEVICE AND CRADLE
    3.
    发明申请
    PORTABLE ELECTRONIC DEVICE AND CRADLE 有权
    便携式电子设备和包装

    公开(公告)号：US20130301201A1

    公开(公告)日：2013-11-14

    申请号：US13832033

    申请日：2013-03-15

    申请人： Wei-Chih Hsu ,  Shi-Kuan Chen ,  Hong-Tien Wang ,  Yung-Hsiang Chen ,  Shih-Chin Gong ,  Yung-Ming Tien ,  Chun-Huang Yu ,  Chao-Tung Hsu ,  Jui-Che Hsu ,  Chih-Yin Lai ,  Chia-Sheng Liu

    发明人： Wei-Chih Hsu ,  Shi-Kuan Chen ,  Hong-Tien Wang ,  Yung-Hsiang Chen ,  Shih-Chin Gong ,  Yung-Ming Tien ,  Chun-Huang Yu ,  Chao-Tung Hsu ,  Jui-Che Hsu ,  Chih-Yin Lai ,  Chia-Sheng Liu

    IPC分类号： H05K5/02 ,  F16M11/00

    CPC分类号： H05K5/0221 ,  F16M11/00 ,  G06F1/1632

    摘要： A portable electronic device adapted to be detachably connected to a cradle having a containing cavity is provided, wherein an inner wall of the containing cavity has a recess. The portable electronic device includes a body and a locking-and-releasing mechanism disposed in the body and including a driving unit and a latch. The driving unit is disposed in the body. The latch is connected to the driving unit and suitable for being driven by the driving unit to protrude out of the body or hide in the body. When the portable electronic device is disposed in the containing cavity, the driving unit drives the latch to protrude out of the body and be engaged with the recess. When the portable electronic device is going to be detached from the containing cavity, the driving unit drives the latch to be disengaged from the recess and move back in the body.

    摘要翻译： 提供了一种适于可拆卸地连接到具有容纳腔的托架的便携式电子设备，其中容纳腔的内壁具有凹部。 便携式电子设备包括主体和设置在主体中并包括驱动单元和闩锁的锁定和释放机构。 驱动单元设置在身体中。 闩锁连接到驱动单元并且适于被驱动单元驱动以从身体突出或隐藏在身体中。 当便携式电子设备设置在容纳空腔中时，驱动单元驱动闩锁突出到主体外并与凹槽接合。 当便携式电子设备将从容纳腔体分离时，驱动单元驱动闩锁以从凹部脱离并在身体中向后移动。

    STRUCTURE AND METHOD FOR E-BEAM IN-CHIP OVERLAY MARK
    7.
    发明申请
    STRUCTURE AND METHOD FOR E-BEAM IN-CHIP OVERLAY MARK 有权
    电子束芯片覆盖标记的结构和方法

    公开(公告)号：US20130147066A1

    公开(公告)日：2013-06-13

    申请号：US13314644

    申请日：2011-12-08

    申请人： Dong-Hsu Cheng ,  Ming-Ho Tsai ,  Chih-Chung Huang ,  Yung-Hsiang Chen ,  Chun-Hung Chen

    发明人： Dong-Hsu Cheng ,  Ming-Ho Tsai ,  Chih-Chung Huang ,  Yung-Hsiang Chen ,  Chun-Hung Chen

    IPC分类号： H01L23/544 ,  H01L21/762

    CPC分类号： H01L22/12 ,  G03F7/70633

    摘要： The present disclosure provides an integrated circuit structure that includes a semiconductor substrate having a first region and a second region having an area less than about 10 micron×10 micron; a first material layer over the semiconductor substrate and patterned to have a first circuit feature in the first region and a first mark in the second region; and a second material layer over the first material layer and patterned to have a second circuit feature in the first region and a second mark in the second region. The first mark includes first mark features oriented in a first direction, and second mark features oriented in a second direction perpendicular to the first direction. The second mark includes third mark features oriented in the first direction, and fourth mark features oriented in the second direction.

    摘要翻译： 本公开提供了一种集成电路结构，其包括具有第一区域的半导体衬底和具有小于约10微米×10微米的面积的第二区域; 半导体衬底上的第一材料层，并被图案化以具有第一区域中的第一电路特征和第二区域中的第一标记; 以及在所述第一材料层之上的第二材料层，并被图案化以具有所述第一区域中的第二电路特征和所述第二区域中的第二标记。 第一标记包括沿第一方向定向的第一标记特征，以及在垂直于第一方向的第二方向上定向的第二标记特征。 第二标记包括沿第一方向定向的第三标记特征，第四标记特征指向第二方向。