Patterned wafer thickness detection system
    1.
    发明申请
    Patterned wafer thickness detection system 审中-公开
    图案化晶圆厚度检测系统

    公开(公告)号:US20060062897A1

    公开(公告)日:2006-03-23

    申请号:US11034349

    申请日:2005-01-11

    IPC分类号: B05D3/12

    摘要: An apparatus and a method of controlling an electroless deposition process by directing electromagnetic radiation towards the surface of a substrate and detecting the change in intensity of the electromagnetic radiation at one or more wavelengths reflected off features on the surface of the substrate is provided. In one embodiment, the detected end of an electroless deposition process step is measured while the substrate is rotated relative to the detection mechanism. In another embodiment, a detection mechanism, which is proximate to the processing region, directs electromagnetic radiation onto a substrate surface, which is then reflected by features on the substrate surface and is detected by the detection mechanism. In one aspect, the angle of the directed electromagnetic radiation is perpendicular to the surface of the substrate and the shape of the directed electromagnetic radiation spot is substantially circular in shape. In another aspect, the directed electromagnetic radiation spot is positioned at the center of rotation of the substrate. A controller can be used to monitor, store, and/or control the electroless deposition process by use of stored process values, comparison of data collected at different times, and various calculated time dependent data.

    摘要翻译: 提供了一种通过将电磁辐射引导到衬底的表面并检测在衬底的表面上被反射的特征的一个或多个波长处的电磁辐射的强度变化来控制无电沉积工艺的装置和方法。 在一个实施例中,在基板相对于检测机构旋转的同时测量无电沉积工艺步骤的检测结束。 在另一个实施例中,靠近处理区域的检测机构将电磁辐射引导到衬底表面上,然后其被衬底表面上的特征反射并被检测机构检测。 一方面,定向电磁辐射的角度垂直于衬底的表面,并且定向电磁辐射光斑的形状基本上是圆形的。 在另一方面,定向电磁辐射光斑位于基底的旋转中心。 控制器可用于通过使用存储的过程值,不同时间收集的数据的比较和各种计算的时间相关数据来监测,存储和/或控制无电沉积过程。