公开(公告)号：US20170346130A1

公开(公告)日：2017-11-30

申请号：US15520940

申请日：2015-10-23

Applicant: ZEON CORPORATION

Inventor： Kouichirou MAEDA ,  Taku MATSUMURA ,  Kunihito ARAI

IPC: H01M10/058 ,  H01M2/14 ,  H01M2/34 ,  H01M10/052

Abstract: The double-sided tape for fixing an electrode constituent body is used in an electrochemical device that houses in a pouch-type outer casing an electrode constituent body wherein a positive electrode member, a separator member and a negative electrode member are layered or wound. The double-sided tape comprises a surface having a pressure-sensitive adhesive for adhering to the electrode constituent body, and a surface having a heat-sensitive adhesive for adhering to the pouch-type outer casing.

公开(公告)号：US20200094249A1

公开(公告)日：2020-03-26

申请号：US16495543

申请日：2018-03-14

Applicant: ZEON CORPORATION

Inventor： Daido CHIBA ,  Kunihito ARAI ,  Taichi SAWAGUCHI ,  Mitsukazu AIZAWA ,  Noriyuki ARITOME

IPC: B01L3/00

Abstract: Disclosed is method of manufacturing a microchannel chip by joining together a resin channel substrate having microchannels formed on at least one side thereof and a resin lid substrate, the method including: a step (A) wherein surface modification treatment is applied on joining surfaces of the channel substrate and the lid substrate; and a step (B) wherein, after the step (A), the joining surfaces of the channel substrate and the lid substrate are mated and the channel substrate and the lid substrate are pressurized under heating via a fluid or an elastic body having a durometer hardness of E20 or less.

公开(公告)号：US20240075694A1

公开(公告)日：2024-03-07

申请号：US18261482

申请日：2022-02-24

Applicant: ZEON CORPORATION

Inventor： Kunihito ARAI

IPC: B29C65/48 ,  B29C65/02

CPC classification number: B29C65/4895 ,  B29C65/02

Abstract: Disclosed is a method of joining resin members that includes: forming a coating layer by applying a solvent to a surface of a resin member, the solvent allowing the thermoplastic resin to have a degree of swelling of 1.05 or more and 3.00 or less when the thermoplastic resin is swollen by the solvent, and having a boiling point B° C. of R ° C. or lower where R ° C. is a glass transition temperature of the thermoplastic resin; laminating resin members one another via the coating layer to form a laminate; and pressing the laminate in the lamination direction while heating at a heating temperature H ° C. that is equal to or lower than R ° C.