公开(公告)号：US11484878B2

公开(公告)日：2022-11-01

申请号：US16495543

申请日：2018-03-14

Applicant: ZEON CORPORATION

Inventor： Daido Chiba ,  Kunihito Arai ,  Taichi Sawaguchi ,  Mitsukazu Aizawa ,  Noriyuki Aritome

IPC: B01L3/00

Abstract: Disclosed is method of manufacturing a microchannel chip by joining together a resin channel substrate having microchannels formed on at least one side thereof and a resin lid substrate, the method including: a step (A) wherein surface modification treatment is applied on joining surfaces of the channel substrate and the lid substrate; and a step (B) wherein, after the step (A), the joining surfaces of the channel substrate and the lid substrate are mated and the channel substrate and the lid substrate are pressurized under heating via a fluid or an elastic body having a durometer hardness of E20 or less.