公开(公告)号：US20150329750A1

公开(公告)日：2015-11-19

申请号：US14443115

申请日：2013-11-13

Applicant: ZEON CORPORATION

Inventor： Atsushi Ishiguro ,  Ryuta Kurihara ,  Youhei Koide ,  Daido Chiba

IPC: C09J153/00 ,  C09J123/20

CPC classification number: C09J153/005 ,  C08F287/00 ,  C08L51/00 ,  C08L53/02 ,  C08L53/025 ,  C09J123/20 ,  C09J2423/003 ,  C09J2453/003 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50 ,  C08L83/06

Abstract: A resin composition including an alkoxysilyl group-containing hydrogenated block copolymer [3], and a hydrocarbon-based polymer [4] having a number average molecular weight of 300 to 5000, the resin composition including the hydrocarbon-based polymer [4] in an amount of 1 to 50 parts by weight based on 100 parts by weight of the alkoxysilyl group-containing hydrogenated block copolymer [3], the alkoxysilyl group-containing hydrogenated block copolymer [3] being obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer [2] that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer [1] that includes at least two polymer blocks [A] and at least one polymer block [B], and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer [1] to a weight fraction wB of the polymer block [B] in the block copolymer [1] being 30:70 to 65:35.

Abstract translation: 包含含烷氧基甲硅烷基的氢化嵌段共聚物[3]和数均分子量为300〜5000的烃系聚合物[4]的树脂组合物，包含烃系聚合物[4]的树脂组合物 相对于100重量份含烷氧基甲硅烷基的氢化嵌段共聚物[3]，含有烷氧基甲硅烷基的氢化嵌段共聚物[3]为1〜50重量份，通过将烷氧基甲硅烷基引入氢化嵌段共聚物 [2]是通过使包含至少两个聚合物嵌段[A]和至少一个聚合物嵌段[B]的嵌段共聚物[1]的90％以上的不饱和键氢化而得到的，[wA：wB] 嵌段共聚物[1]中的聚合物嵌段[A]的重量分数wA与嵌段共聚物[1]中的聚合物嵌段[B]的重量分数wB为30:70至65:35。

公开(公告)号：US10553818B2

公开(公告)日：2020-02-04

申请号：US16080750

申请日：2017-03-13

Applicant: ZEON CORPORATION

Inventor： Daido Chiba ,  Teiji Kohara

IPC: H01L51/52 ,  C09K3/10 ,  C08F297/04 ,  H01L51/00

Abstract: The invention is a method for manufacturing an organic electronic device sealing body, adhesively integrating an organic electronic device with a sheet-like sealant made of a modified hydrocarbon-based soft resin having an alkoxysilyl group, the method comprising steps of: step [1]: laminating the organic electronic device and the sheet-like sealant to obtain a laminate; step [2]: putting the resulting laminate into a resin bag, degassing the bag, and then sealing the bag containing the laminate; and step [3]: placing the sealed bag under a pressure of 0.1 MPa or higher to adhesively integrate the laminate. One aspect of the invention provides a method for manufacturing an organic electronic device sealing body which allows industrially-advantageous sealing of the organic electronic device including organic functional elements such as an organic EL element and an organic semiconductor element.

公开(公告)号：US11624010B2

公开(公告)日：2023-04-11

申请号：US17052805

申请日：2019-05-15

Applicant: ZEON CORPORATION

Inventor： Daido Chiba

IPC: C09J153/02 ,  C08K5/14 ,  B29B7/00 ,  B29B7/14 ,  B29B7/20 ,  B29B7/24 ,  B29B7/82 ,  B29B7/88 ,  B29B9/06 ,  C08K5/3475 ,  C08K5/5419

Abstract: A method of producing an adhesive resin includes: a heating and kneading step of kneading a mixture containing a ring structure-containing hydrocarbon resin, an adhesive functional group-containing compound, and a peroxide while heating the mixture to obtain a heated and kneaded product; and a cooling and kneading step, performed in succession to the heating and kneading step, of kneading the heated and kneaded product while cooling the heated and kneaded product to obtain a cooled and kneaded product. The adhesive resin has a yellowness index (Yi) of 3.0 or less when 0.8 parts by mass of 2-(5-chloro-2-benzotriazolyl)-6-tert-butyl-p-cresol is added to 100 parts by mass of the adhesive resin.

公开(公告)号：US11484878B2

公开(公告)日：2022-11-01

申请号：US16495543

申请日：2018-03-14

Applicant: ZEON CORPORATION

Inventor： Daido Chiba ,  Kunihito Arai ,  Taichi Sawaguchi ,  Mitsukazu Aizawa ,  Noriyuki Aritome

IPC: B01L3/00

Abstract: Disclosed is method of manufacturing a microchannel chip by joining together a resin channel substrate having microchannels formed on at least one side thereof and a resin lid substrate, the method including: a step (A) wherein surface modification treatment is applied on joining surfaces of the channel substrate and the lid substrate; and a step (B) wherein, after the step (A), the joining surfaces of the channel substrate and the lid substrate are mated and the channel substrate and the lid substrate are pressurized under heating via a fluid or an elastic body having a durometer hardness of E20 or less.

公开(公告)号：US11440303B2

公开(公告)日：2022-09-13

申请号：US16639585

申请日：2018-06-11

Applicant: ZEON CORPORATION

Inventor： Ryuta Kurihara ,  Daido Chiba

IPC: B32B27/30 ,  B32B27/32 ,  B32B38/18 ,  C08L53/02

Abstract: Disclosed is a laminate which includes one or more soft layers and an electronic device enclosed by the one or more soft layers, wherein the one or more soft layers have a flexural modulus of 80 MPa or more and 1,000 MPa or less and a water vapor permeability at 40° C. and 90% RH of 15 [g/(m2·24 h)·100 μm] or less.

公开(公告)号：US10328674B2

公开(公告)日：2019-06-25

申请号：US15322137

申请日：2015-07-07

Applicant: ZEON CORPORATION

Inventor： Teiji Kohara ,  Daido Chiba

IPC: B32B3/00 ,  B32B17/10 ,  C08C19/25 ,  C23C14/08 ,  C23C14/18 ,  C23C14/35 ,  E06B3/67

Abstract: Provided is a laminated glass including, in order: a first glass sheet; a first interlayer film; a transparent film laminated with a heat reflection film; a second interlayer film; and a second glass sheet, wherein the first interlayer film and the second interlayer film are formed of a modified hydrogenated block copolymer [E], the modified hydrogenated block copolymer [E] is a hydrogenated block copolymer [D] in which an alkoxysilyl group is incorporated, the hydrogenated block copolymer [D] being a block copolymer [C] in which 90% or more of all unsaturated bonds is hydrogenated, the block copolymer [C] is composed of at least two polymer blocks [A] including a repeat unit derived from an aromatic vinyl compound, and at least one polymer block [B] including a repeat unit derived from a linear conjugated diene compound, and the ratio of weight fraction [A]:[B] is 30:70 to 60:40.

公开(公告)号：US09493688B2

公开(公告)日：2016-11-15

申请号：US14443115

申请日：2013-11-13

Applicant: ZEON CORPORATION

Inventor： Atsushi Ishiguro ,  Ryuta Kurihara ,  Youhei Koide ,  Daido Chiba

IPC: C09J153/00 ,  C09J123/20 ,  C08L53/02 ,  C08F287/00 ,  C08L51/00 ,  H01L31/048

CPC classification number: C09J153/005 ,  C08F287/00 ,  C08L51/00 ,  C08L53/02 ,  C08L53/025 ,  C09J123/20 ,  C09J2423/003 ,  C09J2453/003 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50 ,  C08L83/06

Abstract: A resin composition including an alkoxysilyl group-containing hydrogenated block copolymer [3], and a hydrocarbon-based polymer [4] having a number average molecular weight of 300 to 5000, the resin composition including the hydrocarbon-based polymer [4] in an amount of 1 to 50 parts by weight based on 100 parts by weight of the alkoxysilyl group-containing hydrogenated block copolymer [3], the alkoxysilyl group-containing hydrogenated block copolymer [3] being obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer [2] that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer [1] that includes at least two polymer blocks [A] and at least one polymer block [B], and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer [1] to a weight fraction wB of the polymer block [B] in the block copolymer [1] being 30:70 to 65:35.

Abstract translation: 包含含烷氧基甲硅烷基的氢化嵌段共聚物[3]和数均分子量为300〜5000的烃系聚合物[4]的树脂组合物，包含烃系聚合物[4]的树脂组合物 相对于100重量份含烷氧基甲硅烷基的氢化嵌段共聚物[3]，含有烷氧基甲硅烷基的氢化嵌段共聚物[3]为1〜50重量份，通过将烷氧基甲硅烷基引入氢化嵌段共聚物 [2]是通过使包含至少两个聚合物嵌段[A]和至少一个聚合物嵌段[B]的嵌段共聚物[1]的90％以上的不饱和键氢化而得到的，[wA：wB] 嵌段共聚物[1]中的聚合物嵌段[A]的重量分数wA与嵌段共聚物[1]中的聚合物嵌段[B]的重量分数wB为30:70至65:35。