公开(公告)号：US20250007174A1

公开(公告)日：2025-01-02

申请号：US18264898

申请日：2023-02-02

Applicant: ZHEJIANG LAB

Inventor： Xiaoyan LI ,  Xuan LI ,  Cheng GUO ,  Tong HE ,  Kuiwen XU ,  Xianbin YU

IPC: H01Q15/00 ,  H01Q1/48 ,  H01Q13/02 ,  H01Q15/08 ,  H01Q19/02 ,  H01Q19/10

Abstract: The present application provides an integrated antenna and an antenna apparatus. The integrated antenna includes an antenna substrate, a photodiode and an antenna radiating body. The photodiode is disposed on the antenna substrate and includes two electrodes. The antenna radiating body is disposed on the antenna substrate and connected with the two electrodes. The antenna radiating body is disposed on an upper surface of the photodiode.

公开(公告)号：US20240429614A1

公开(公告)日：2024-12-26

申请号：US18258545

申请日：2023-05-09

Applicant: ZHEJIANG LAB

Inventor： PREM NARAYAN CHOUBEY ,  Kuiwen XU ,  Xiaoyan LI ,  Xianbin YU

IPC: H01Q9/28 ,  H01Q1/38 ,  H01Q9/06

Abstract: The present disclosure relates to communications technologies, and provides a single polarized ME dipole and a basic radiator of a phased array antenna for millimeter wave or above frequency band. The radiator is an “array of the ME dipoles” with higher dielectric constant, and can be manufactured with the multilayer PCB or LTCC process. The ME dipole comprises an electric dipole made by two parts of a first metal sheet located on a top substrate layer, a magnetic dipole made by first vias connected to the first metal sheet and a third metal sheet located on a bottom substrate layer, a balun made by an other part of the first metal sheet and a third via, and a reflecting part made by a part of the third metal sheet. The substrate layers are stacked in a multilayer structure to facilitate arranging the metal sheets and the vias.