公开(公告)号：US20240373588A1

公开(公告)日：2024-11-07

申请号：US18291775

申请日：2022-03-02

Applicant: ZTE CORPORATION

Inventor： Zhenjie LI ,  Fan LIU ,  Haolong FAN

IPC: H05K7/20

Abstract: Disclosed are a heat dissipation apparatus and an electronic device. The heat dissipation apparatus includes a first cooling plate, provided with a through hole arranged to be connected to an inlet pipe and an outlet pipe; a second cooling plate, with a heat dissipation cavity formed between the first cooling plate and the second cooling plate and in communication with the through hole; and a retractable floating component, connected to the second cooling plate for floating heat dissipation of the second cooling plate.