公开(公告)号：US20240393053A1

公开(公告)日：2024-11-28

申请号：US18693398

申请日：2022-03-14

Applicant: ZTE CORPORATION

Inventor： Kaiwen DUAN ,  Shuai LI ,  Xin LIU ,  Fan LIU ,  Zhidong NIE ,  Yan WANG ,  Mingming ZHAO

IPC: F28D1/03 ,  F28D21/00

Abstract: A heat dissipation assembly and a heat dissipator are disclosed. The heat dissipation assembly may include: a base plate bottom; a base plate cover connected to the base plate bottom and forming a heat collection cavity for concentrating heat; a turbulation component provided in the heat collection cavity, the turbulation component comprising at least one turbulation piece; and a plurality of heat dissipation components connected to the base plate cover, wherein the heat dissipation components are provided with at least one heat dissipation pipeline, the heat dissipation pipeline is provided in communication with the heat collection cavity.

公开(公告)号：US20250157884A1

公开(公告)日：2025-05-15

申请号：US18837382

申请日：2023-02-06

Applicant: ZTE CORPORATION

Inventor： Cheng TAO ,  Fan LIU ,  Xiaodong ZHOU

IPC: H01L23/473 ,  H01L21/3065 ,  H01L21/50 ,  H01L23/40

Abstract: A chip liquid-cooling heat-dissipation structure, a manufacturing method therefor, and an electronic device are disclosed. The chip liquid-cooling heat-dissipation structure may include a bare chip and a cover plate. The bare chip is provided with a chip body, and a plurality of microchannels are etched on a surface of the chip body. The cover plate is configured to cover the microchannels. The cover plate is detachably connected to the bare chip, and is provided with an inlet and an outlet. The microchannels are communicated with the inlet and the outlet.

公开(公告)号：US20240373588A1

公开(公告)日：2024-11-07

申请号：US18291775

申请日：2022-03-02

Applicant: ZTE CORPORATION

Inventor： Zhenjie LI ,  Fan LIU ,  Haolong FAN

IPC: H05K7/20

Abstract: Disclosed are a heat dissipation apparatus and an electronic device. The heat dissipation apparatus includes a first cooling plate, provided with a through hole arranged to be connected to an inlet pipe and an outlet pipe; a second cooling plate, with a heat dissipation cavity formed between the first cooling plate and the second cooling plate and in communication with the through hole; and a retractable floating component, connected to the second cooling plate for floating heat dissipation of the second cooling plate.

公开(公告)号：US20240276678A1

公开(公告)日：2024-08-15

申请号：US18567574

申请日：2022-03-14

Applicant: ZTE CORPORATION ,  INSTITUTE OF SPACECRAFT SYSTEM ENGINEERING

Inventor： Cheng TAO ,  Yalong WANG ,  Fan LIU ,  Shuai LI ,  Xiaodong ZHOU ,  Xingang YU

IPC: H05K7/20

CPC classification number: H05K7/20381 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327

Abstract: A pump-driven two-phase liquid cooling system, and a liquid supplementation control method for a pump-driven two-phase liquid cooling system are disclosed. The pump-driven two-phase liquid cooling system may include a pump-driven two-phase liquid circulation loop, where a pump, an evaporator, and a condenser are sequentially arranged in the pump-driven two-phase liquid circulation loop; a first liquid storage tank arranged at a front end of the pump; and a second liquid storage tank in fluid communication with the first liquid storage tank through a first connecting pipeline; where the second liquid storage tank is provided with a first liquid filling port, and the first connecting pipeline is provided with a first valve configured to isolate the second liquid storage tank from the first liquid storage tank.

公开(公告)号：US20170238443A1

公开(公告)日：2017-08-17

申请号：US15320436

申请日：2014-12-02

Applicant: ZTE CORPORATION

Inventor： Yulong GUO ,  Jiangang WENG ,  Jun WAN ,  Fan LIU

IPC: H05K7/20 ,  H05K7/14 ,  A62C35/64 ,  E04H5/02 ,  F24F13/02

CPC classification number: H05K7/20709 ,  A62C35/645 ,  E04H5/02 ,  E04H2005/005 ,  F24F13/02 ,  H05K7/1491 ,  H05K7/1494 ,  H05K7/1497 ,  H05K7/20745

Abstract: A modular data machine room includes a data cabinet subsystem, a cooling subsystem and a power distribution subsystem. The data cabinet subsystem includes two columns of data cabinet groups, and each column of data cabinet group includes at least one data cabinet. The cooling subsystem includes at least one cooling unit, and the cooling unit is arranged in the two columns of data cabinet groups. Each data cabinet and cooling unit is connected with the power distribution subsystem through an interface. The machine room further includes a sealing subsystem, which seals a cold/hot channel between the two columns of data cabinet groups. The machine room has a short construction period and a high cooling efficiency.

公开(公告)号：US20240377284A1

公开(公告)日：2024-11-14

申请号：US18688011

申请日：2022-03-02

Applicant: ZTE CORPORATION ,  INSTITUTE OF SPACECRAFT SYSTEM ENGINEERING

Inventor： Cheng TAO ,  Yalong WANG ,  Fan LIU ,  Xiaodong ZHOU ,  Shuai LI ,  Xingang YU

IPC: G01M99/00 ,  H05K7/20

Abstract: A system and method for testing two-phase liquid cooling are disclosed. The system may include, a liquid storage tank; a power pump having an inlet in communication with an outlet of the liquid storage tank; a regenerator having a first loop and a second loop and a first regulating valve; a preheater and a second regulating valve; a liquid outlet port and a liquid outlet valve; a liquid inlet port and a liquid inlet valve; and a condenser having an inlet in communication with an outlet of the second loop.