公开(公告)号：US20210392744A1

公开(公告)日：2021-12-16

申请号：US17282410

申请日：2019-09-27

Applicant: ZTE CORPORATION

Inventor： Changgang YIN ,  Yingxin WANG ,  Bi YI ,  Huazhang CAO

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/42

Abstract: Provided are a circuit board, an apparatus and a method for forming a via hole structure. A via hole structure formed on a main body (10) of a circuit board includes a hole (12) enclosed by a conductive layer in the main body (10), the conductive layer constitutes a wall (11) of the hole (12), and a dielectric filling layer (13), which has a dielectric constant smaller than that of the main body (10), is disposed between at least a portion of the wall (11) of the hole (12) and the main body (10), so that the parasitic capacitance of a via hole is decreased, and the impedance of the via hole is increased to become closer to the impedance of a transmission line, thereby effectively improving impedance continuity of a system link.

公开(公告)号：US20210092830A1

公开(公告)日：2021-03-25

申请号：US17106069

申请日：2020-11-27

Applicant: ZTE CORPORATION

Inventor： Changgang YIN ,  Huazhang CAO ,  Yingxin WANG

IPC: H05K1/02

Abstract: Provided is a circuit board, a signal crosstalk suppression method, a storage medium and an electronic device. The circuit board includes: a circuit board body, provided with a signal via-hole structure, a ground via-hole structure and a slotted structure; the signal via-hole structure is configured to transmit a signal by changing a layer, and the ground via-hole structure is configured to return a signal transmitted from the signal via-hole structure; the slotted structure is provided between the signal via-hole structure and the ground via-hole structure, and configured to suppress a signal crosstalk of the signal via-hole structure.