HEAT DISSIPATION ASSEMBLY AND CONTROL METHOD AND APPARATUS THEREFOR, AND HEAT DISSIPATOR AND COMMUNICATION DEVICE

    公开(公告)号:US20250048585A1

    公开(公告)日:2025-02-06

    申请号:US18717603

    申请日:2022-12-05

    Abstract: Disclosed are a heat dissipation assembly and a control method therefor, an apparatus, a heat dissipator, and a communication device. The heat dissipation assembly may include: a vibration plate unit, provided with a vibration plate and at least one piezoelectric sheet connected to the vibration plate; and a drive unit, electrically connected to the vibration plate unit, and the drive unit is configured to: adjust, in response to meeting a trigger condition, a first driving frequency output to the piezoelectric sheet within a preset frequency range to obtain a plurality of corresponding first output currents, determine a target driving frequency based on the plurality of first output currents, and apply a driving voltage to the piezoelectric sheet based on the target driving frequency.

Patent Agency Ranking