公开(公告)号：US20250048585A1

公开(公告)日：2025-02-06

申请号：US18717603

申请日：2022-12-05

Applicant: ZTE CORPORATION

Inventor： Xianming ZHANG ,  Daiyan LAN ,  Yue ZHU ,  Jie YANG ,  Jie QIAN ,  Wei DING

IPC: H05K7/20

Abstract: Disclosed are a heat dissipation assembly and a control method therefor, an apparatus, a heat dissipator, and a communication device. The heat dissipation assembly may include: a vibration plate unit, provided with a vibration plate and at least one piezoelectric sheet connected to the vibration plate; and a drive unit, electrically connected to the vibration plate unit, and the drive unit is configured to: adjust, in response to meeting a trigger condition, a first driving frequency output to the piezoelectric sheet within a preset frequency range to obtain a plurality of corresponding first output currents, determine a target driving frequency based on the plurality of first output currents, and apply a driving voltage to the piezoelectric sheet based on the target driving frequency.

公开(公告)号：US20250125219A1

公开(公告)日：2025-04-17

申请号：US18689584

申请日：2022-07-11

Applicant: ZTE Corporation

Inventor： Weifeng ZHANG ,  Xianming ZHANG ,  Zhida WANG ,  Xijie WU ,  Yanhua GUO

IPC: H01L23/40 ,  H05K1/02 ,  H05K1/18

Abstract: Disclosed are a heat sink fixing structure and a board-level heat dissipation apparatus. The heat sink fixing structure comprises a support structure and a floating structure; the support structure comprises a first support member for providing support for the semiconductor component and a second support member spaced apart from the first support member; the heat sink is arranged corresponding to the semiconductor component and is connected to the second support member in a floating configuration, making it adaptable to semiconductor components of different heights and tolerances, effectively reducing the temperature of semiconductor components and improving long-term reliability. By using the first and second support members to respectively support the heat sink and semiconductor components, the number of openings near the semiconductor component on the integrated circuit board is reduced, thereby reducing the wiring difficulty of the integrated circuit board and reducing the stress it bears.