公开(公告)号：US20250125219A1

公开(公告)日：2025-04-17

申请号：US18689584

申请日：2022-07-11

Applicant: ZTE Corporation

Inventor： Weifeng ZHANG ,  Xianming ZHANG ,  Zhida WANG ,  Xijie WU ,  Yanhua GUO

IPC: H01L23/40 ,  H05K1/02 ,  H05K1/18

Abstract: Disclosed are a heat sink fixing structure and a board-level heat dissipation apparatus. The heat sink fixing structure comprises a support structure and a floating structure; the support structure comprises a first support member for providing support for the semiconductor component and a second support member spaced apart from the first support member; the heat sink is arranged corresponding to the semiconductor component and is connected to the second support member in a floating configuration, making it adaptable to semiconductor components of different heights and tolerances, effectively reducing the temperature of semiconductor components and improving long-term reliability. By using the first and second support members to respectively support the heat sink and semiconductor components, the number of openings near the semiconductor component on the integrated circuit board is reduced, thereby reducing the wiring difficulty of the integrated circuit board and reducing the stress it bears.