System and apparatus for reducing arcing and localized heating during
microwave processing
    1.
    发明授权
    System and apparatus for reducing arcing and localized heating during microwave processing 失效
    微波处理期间减少电弧和局部加热的系统和装置

    公开(公告)号:US5750968A

    公开(公告)日:1998-05-12

    申请号:US497603

    申请日:1995-06-30

    IPC分类号: H05B6/80 H05K3/34

    摘要: A system and apparatus for reducing arcing and localized heating as a result of applying microwave energy to a microelectronic substrate having electronic components thereon is provided. A microwave furnace having a chamber is configured to secure a microelectronic substrate therewithin. The microelectronic substrate is electrically interconnected with a ground connected to an interior wall of the microwave furnace. A holder for securing a microelectronic substrate during the application of microwave energy and for providing the necessary electrical connections for grounding components and circuitry thereon is also provided. The holder may have a heat sink for protection against heat build-up and for maintaining a microelectronic substrate in a substantially flat orientation during microwave processing.

    摘要翻译: 提供了一种用于通过向其上具有电子部件的微电子基板施加微波能量来减少电弧和局部加热的系统和装置。 具有室的微波炉配置成将微电子衬底固定在其中。 微电子衬底与连接到微波炉内壁的接地电互连。 还提供了一种用于在施加微波能量期间固定微电子衬底并用于为其上接地部件和电路提供必要的电连接的保持器。 保持器可以具有用于防止热积聚的散热器并且用于在微波处理期间将微电子基板保持在基本平坦的取向。