公开(公告)号：US20220038825A1

公开(公告)日：2022-02-03

申请号：US17279749

申请日：2019-09-17

Applicant: ams AG

Inventor： Goran STOJANOVIC ,  Colin STEELE ,  Simon MUELLER ,  Thomas FROEHLICH ,  Erik Jan LOUS ,  Anderson PIRES SINGULANI

IPC: H04R19/04 ,  H04R19/00 ,  H04R31/00

Abstract: A micro-electro-mechanical system, MEMS, microphone assembly comprises an enclosure defining a first cavity, and a MEMS microphone arranged inside the first cavity. The microphone comprises a first die with bonding structures and a MEMS diaphragm, and a second die having an application specific integrated circuit, ASIC. The second die is bonded to the bonding structures such that a gap is formed between a first side of the diaphragm and the second die, with the gap defining a second cavity. The first side of the diaphragm is interfacing with the second cavity and a second side of the diaphragm is interfacing with the environment via an acoustic inlet port of the enclosure. The bonding structures are arranged such that pressure ventilation openings are formed that connect the first cavity and the second cavity.

公开(公告)号：US20210400397A1

公开(公告)日：2021-12-23

申请号：US17279302

申请日：2019-08-23

Applicant: ams AG

Inventor： Goran STOJANOVIC ,  Colin STEELE ,  Erik Jan LOUS ,  Anderson PIRES SINGULANI

IPC: H04R23/00 ,  G01H9/00

Abstract: An integrated optical transducer for detecting dynamic pressure changes comprises a micro-electro-mechanical system, MEMS, die having a MEMS diaphragm with a first side exposed to the dynamic pressure changes and a second side. The transducer further comprises an application specific integrated circuit, ASIC, die having an evaluation circuit configured to detect a deflection of the MEMS diaphragm, in particular of the second side of the MEMS diaphragm. The MEMS die is arranged with respect to the ASIC die such that a gap with a gap height is formed between the second side of the diaphragm and a first surface of the ASIC die and the MEMS diaphragm, the ASIC die and a suspension structure of the MEMS die delineate a back volume of the integrated optical transducer.