公开(公告)号：US20210400397A1

公开(公告)日：2021-12-23

申请号：US17279302

申请日：2019-08-23

Applicant: ams AG

Inventor： Goran STOJANOVIC ,  Colin STEELE ,  Erik Jan LOUS ,  Anderson PIRES SINGULANI

IPC: H04R23/00 ,  G01H9/00

Abstract: An integrated optical transducer for detecting dynamic pressure changes comprises a micro-electro-mechanical system, MEMS, die having a MEMS diaphragm with a first side exposed to the dynamic pressure changes and a second side. The transducer further comprises an application specific integrated circuit, ASIC, die having an evaluation circuit configured to detect a deflection of the MEMS diaphragm, in particular of the second side of the MEMS diaphragm. The MEMS die is arranged with respect to the ASIC die such that a gap with a gap height is formed between the second side of the diaphragm and a first surface of the ASIC die and the MEMS diaphragm, the ASIC die and a suspension structure of the MEMS die delineate a back volume of the integrated optical transducer.

公开(公告)号：US20220038825A1

公开(公告)日：2022-02-03

申请号：US17279749

申请日：2019-09-17

Applicant: ams AG

Inventor： Goran STOJANOVIC ,  Colin STEELE ,  Simon MUELLER ,  Thomas FROEHLICH ,  Erik Jan LOUS ,  Anderson PIRES SINGULANI

IPC: H04R19/04 ,  H04R19/00 ,  H04R31/00

Abstract: A micro-electro-mechanical system, MEMS, microphone assembly comprises an enclosure defining a first cavity, and a MEMS microphone arranged inside the first cavity. The microphone comprises a first die with bonding structures and a MEMS diaphragm, and a second die having an application specific integrated circuit, ASIC. The second die is bonded to the bonding structures such that a gap is formed between a first side of the diaphragm and the second die, with the gap defining a second cavity. The first side of the diaphragm is interfacing with the second cavity and a second side of the diaphragm is interfacing with the environment via an acoustic inlet port of the enclosure. The bonding structures are arranged such that pressure ventilation openings are formed that connect the first cavity and the second cavity.

公开(公告)号：US20210175153A1

公开(公告)日：2021-06-10

申请号：US17052452

申请日：2019-03-20

Applicant: ams AG

Inventor： Jochen KRAFT ,  Georg PARTEDER ,  Anderson PIRES SINGULANI ,  Raffaele COPPETA ,  Franz SCHRANK

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/528

Abstract: A semiconductor device includes a semiconductor body, an electrically conductive via which extends through at least a part of the semiconductor body, and where the via has a top side and a bottom side that faces away from the top side, an electrically conductive etch-stop layer arranged at the bottom side of the via in a plane which is parallel to a lateral direction, where the lateral direction is perpendicular to a vertical direction given by the main axis of extension of the via, and at least one electrically conductive contact layer at the bottom side of the via in a plane which is parallel to the lateral direction. The etch-stop layer is arranged between the electrically conductive via and the contact layer in the vertical direction, the lateral extent in the lateral direction of the etch-stop layer amounts to at least 2.5 times the lateral extent of the via in the lateral direction, and the lateral extent of the contact layer is smaller than the lateral extent of the via or the lateral extent of the contact layer amounts to at least 2.5 times the lateral extent of the via.

公开(公告)号：US20210072134A1

公开(公告)日：2021-03-11

申请号：US16772416

申请日：2018-12-13

Applicant: ams AG ,  Technische Universität Graz

Inventor： Jochen Kraft ,  Georg Röhrer ,  Fernando Jesus CASTANO SANCHEZ ,  Anderson PIRES SINGULANI ,  Paul MAIERHOFER

IPC: G01N15/06

Abstract: The particle sensor device comprises a substrate, a photodetector, a dielectric on or above the substrate, a source of electromagnetic radiation, and a through-substrate via in the substrate. The through-substrate via is exposed to the environment, in particular to ambient air. A waveguide is arranged in or above the dielectric so that the electromagnetic radiation emitted by the source of electromagnetic radiation is coupled into a portion of the waveguide. A further portion of the waveguide is opposite the photodetector, so that said portions of the waveguide are on different sides of the through-substrate via, and the waveguide traverses the through-substrate via.

公开(公告)号：US20210040943A1

公开(公告)日：2021-02-11

申请号：US16967828

申请日：2019-02-01

Applicant: ams AG

Inventor： Raffaele COPPETA ,  Jacopo BRIVIO ,  Anderson PIRES SINGULANI ,  Verena VESCOLI

IPC: F04B43/04 ,  F04B43/02

Abstract: A pumping structure comprises at least two membranes, at least two actuation chambers, one evaluation chamber comprising an opening to the outside of the pumping structure, and at least three electrodes. Each membrane is arranged between two electrodes in a vertical direction which is perpendicular to the main plane of extension of the pumping structure, each actuation chamber is arranged between one of the membranes and one of the electrodes in vertical direction, and each actuation chamber is connected to the evaluation chamber via a channel. Furthermore, a particle detector and a method for pumping are provided.