OPTOELECTRONIC ASSEMBLY
    1.
    发明申请

    公开(公告)号:US20240402506A1

    公开(公告)日:2024-12-05

    申请号:US18262773

    申请日:2021-12-20

    Abstract: The invention relates to an optoelectronic assembly including at least two semiconductor laser components, which are designed to emit electromagnetic radiation, and an optical superpositioning element with at least one radiation inlet surface and a radiation outlet surface. Each semiconductor laser component is paired with a respective optical element, and each semiconductor laser component emits an inlet beam bundle or a plurality of spatially separated inlet beam bundles. All of the inlet beam bundles of a semiconductor laser component pass through the respective paired optical element, wherein a plurality of inlet beam bundles emitted by a semiconductor laser component are fanned out relative to each other after passing through the optical element such that the inlet beam bundles enter the optical superpositioning element at different inlet angles. Inlet beam bundles from different semiconductor laser components exit together at the radiation outlet surface of the optical superpositioning element in a plurality of outlet beam bundles.

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