公开(公告)号：US20240402506A1

公开(公告)日：2024-12-05

申请号：US18262773

申请日：2021-12-20

Applicant: ams-OSRAM International GmbH

Inventor： Nicole BERNER ,  Jörg Erich SORG ,  Karsten AUEN

IPC: G02B27/09 ,  G02B27/14 ,  G03B21/20 ,  H01S5/40

Abstract: The invention relates to an optoelectronic assembly including at least two semiconductor laser components, which are designed to emit electromagnetic radiation, and an optical superpositioning element with at least one radiation inlet surface and a radiation outlet surface. Each semiconductor laser component is paired with a respective optical element, and each semiconductor laser component emits an inlet beam bundle or a plurality of spatially separated inlet beam bundles. All of the inlet beam bundles of a semiconductor laser component pass through the respective paired optical element, wherein a plurality of inlet beam bundles emitted by a semiconductor laser component are fanned out relative to each other after passing through the optical element such that the inlet beam bundles enter the optical superpositioning element at different inlet angles. Inlet beam bundles from different semiconductor laser components exit together at the radiation outlet surface of the optical superpositioning element in a plurality of outlet beam bundles.

公开(公告)号：US20250047058A1

公开(公告)日：2025-02-06

申请号：US18717306

申请日：2022-11-16

Applicant: ams-OSRAM International GmbH

Inventor： Stephan BERGHOFER ,  Jan SEIDENFADEN ,  Markus RICHTER ,  Nicole BERNER

IPC: H01S5/02251 ,  H01S5/02

Abstract: The invention relates to an optoelectronic semiconductor component having a frame body, which is radiolucent at least in regions, and at least one first semiconductor chip which is designed to emit a first electromagnetic radiation. The frame body has a recess. At least a first waveguide is formed in the frame body. A first coupling surface of the first waveguide is formed on a side surface of the recess facing the first semiconductor chip. A decoupling surface is formed on an outer surface of the frame body. The first semiconductor chip is arranged in the recess in such a way that at least a part of the first electromagnetic radiation enters into the first waveguide. The invention also relates to method for producing a plurality of optoelectronic semiconductor components.