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    Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other
    2.
    发明授权
    Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other 有权
    一种显示装置的制造方法，包括：将第二基板和半导体芯片同时研磨成具有相同厚度的步骤

    公开(公告)号：US09091893B2

    公开(公告)日：2015-07-28

    申请号：US14540391

    申请日：2014-11-13

    Applicant: c/o Japan Display West Inc.

    Inventor： Masumitsu Ino

    IPC: G02F1/1345 ,  G02F1/13 ,  G02F1/1368 ,  G02F1/1339 ,  G02F1/1335 ,  G02F1/13363

    CPC classification number: G02F1/13454 ,  G02F1/133308 ,  G02F1/133528 ,  G02F1/13363 ,  G02F1/1339 ,  G02F1/13452 ,  G02F1/1368 ,  G02F2201/50 ,  H01J9/20

    Abstract: A display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness.

    Abstract translation: 一种显示装置，包括：具有安装在其上的像素开关和驱动器的第一基板; 与所述第一基板相对设置的第二基板; 所述材料层保持在所述第一基板和所述第二基板之间，并且具有由密封构件密封的周边边缘，所述材料层具有电光效应; 以及作为COG部件安装在所述第一基板上的半导体芯片，所述半导体芯片具有被配置为控制所述驱动器的控制系统; 其中所述半导体芯片具有等于所述密封构件和所述第二基板的总厚度的厚度或大于所述密封构件的厚度并且小于所述总厚度。

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