公开(公告)号：US11310903B2

公开(公告)日：2022-04-19

申请号：US17128762

申请日：2020-12-21

Applicant: dSPACE digital signal processing and control engineering GmbH

Inventor： Robert Breicher ,  Van Son Nguyen ,  Johannes Henkel

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/18

Abstract: A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.