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公开(公告)号：US20210132651A1
公开(公告)日：2021-05-06
申请号：US16784291
申请日：2020-02-07
Inventor： Dirk Hasse , Ralf-Peter Fietz , Robert Breicher
Abstract: A modular computer system includes: a housing; at least one container; a data connection; and a housing cover. The at least one container in a lowered state is configured to be connected to a motherboard of the computer system via at least one data connection installed on the outside of the at least one container. The data connection is for exchanging data between pluggable circuit boards in the at least one container and the motherboard of the computer system while the at least one container is in the lowered state. The housing cover is configured to be fixed on the housing. A container holding device is installed on the housing cover, wherein the container holding device is configured to exert a force on the at least one container to fix the at least one container in a shakeproof manner in the housing after the housing cover has been fixed on the housing.
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公开(公告)号：US11194360B2
公开(公告)日：2021-12-07
申请号：US16784291
申请日：2020-02-07
Inventor： Dirk Hasse , Ralf-Peter Fietz , Robert Breicher
Abstract: A modular computer system includes: a housing; at least one container; a data connection; and a housing cover. The at least one container in a lowered state is configured to be connected to a motherboard of the computer system via at least one data connection installed on the outside of the at least one container. The data connection is for exchanging data between pluggable circuit boards in the at least one container and the motherboard of the computer system while the at least one container is in the lowered state. The housing cover is configured to be fixed on the housing. A container holding device is installed on the housing cover, wherein the container holding device is configured to exert a force on the at least one container to fix the at least one container in a shakeproof manner in the housing after the housing cover has been fixed on the housing.
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公开(公告)号：US11310903B2
公开(公告)日：2022-04-19
申请号：US17128762
申请日：2020-12-21
Inventor： Robert Breicher , Van Son Nguyen , Johannes Henkel
Abstract: A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.
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