公开(公告)号：US20220324188A1

公开(公告)日：2022-10-13

申请号：US17845024

申请日：2022-06-21

Applicant: e-Vision Smart Optics, Inc.

Inventor： Anthony Van Heugten ,  Joel D. Zychick

IPC: B29D11/00 ,  B33Y10/00 ,  B33Y80/00 ,  B29C64/112 ,  B33Y40/20 ,  G02C7/08 ,  G02C7/10

Abstract: A method of manufacturing an optic includes disposing electronic circuitry on a substrate. The method also includes depositing a first resin on the first side of the electronic circuitry and curing the first resin to form a first optical segment. The method further includes depositing a second resin on the second side of the electronic circuitry and curing the second resin to form a second optical segment. The first and second optical segments encapsulate the electronic circuitry. The first resin and the second resin can include multiple droplets of resin, thereby reducing mechanical force imposed on the electronic circuitry during printing and allowing conformal contact between the resin and the electronic circuitry. Accordingly, electronic circuitry of smaller dimension can be used to form the electronic eyewear.

公开(公告)号：US11370185B2

公开(公告)日：2022-06-28

申请号：US16348221

申请日：2019-01-10

Applicant: E-VISION SMART OPTICS, INC.

Inventor： Anthony Van Heugten ,  Joel D. Zychick

IPC: B29D11/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y40/20 ,  G02C7/08 ,  G02C7/10 ,  B29K105/00 ,  B29L11/00

Abstract: A method of manufacturing an optic includes disposing electronic circuitry on a substrate. The method also includes depositing a first resin on the first side of the electronic circuitry and curing the first resin to form a first optical segment. The method further includes depositing a second resin on the second side of the electronic circuitry and curing the second resin to form a second optical segment. The first and second optical segments encapsulate the electronic circuitry. The first resin and the second resin can include multiple droplets of resin, thereby reducing mechanical force imposed on the electronic circuitry during printing and allowing conformal contact between the resin and the electronic circuitry. Accordingly, electronic circuitry of smaller dimension can be used to form the electronic eyewear.

公开(公告)号：US20200331219A1

公开(公告)日：2020-10-22

申请号：US16348221

申请日：2019-01-10

Applicant: E-VISION SMART OPTICS, INC.

Inventor： Anthony Van Heugten ,  Joel D. Zychick

IPC: B29D11/00 ,  G02C7/08 ,  G02C7/10 ,  B29C64/112 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y40/20

Abstract: A method of manufacturing an optic includes disposing electronic circuitry on a substrate. The method also includes depositing a first resin on the first side of the electronic circuitry and curing the first resin to form a first optical segment. The method further includes depositing a second resin on the second side of the electronic circuitry and curing the second resin to form a second optical segment. The first and second optical segments encapsulate the electronic circuitry. The first resin and the second resin can include multiple droplets of resin, thereby reducing mechanical force imposed on the electronic circuitry during printing and allowing conformal contact between the resin and the electronic circuitry. Accordingly, electronic circuitry of smaller dimension can be used to form the electronic eyewear.