公开(公告)号：US20230212414A1

公开(公告)日：2023-07-06

申请号：US18090522

申请日：2022-12-29

Applicant: eChem Solutions Corp.

Inventor： Yu-Ning Chen ,  Shao-Li Ho ,  Jia Jheng Lin ,  Hui-Ju Chen

IPC: C09D125/18 ,  C09D161/06 ,  C09D5/00 ,  C09D7/20 ,  C09D7/45 ,  C09D7/65 ,  C09D7/63

CPC classification number: C09D125/18 ,  C09D161/06 ,  C09D5/00 ,  C09D7/20 ,  C09D7/45 ,  C09D7/65 ,  C09D7/63

Abstract: A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).