PRESSURE-SENSITIVE ADHESIVE COMPOSITION
    1.
    发明公开

    公开(公告)号:US20230295473A1

    公开(公告)日:2023-09-21

    申请号:US18021301

    申请日:2021-08-16

    Applicant: tesa SE

    CPC classification number: C09J7/385 C09J133/08 C09J133/10

    Abstract: Disclosed is a pressure-sensitive adhesive composition which exhibits good adhesive forces, in particular on polar adhesive substrates, and good shear strength, and a significant proportion of which can be produced from bio-based raw materials. The pressure-sensitive adhesive composition comprises: at least one copolymer which can be traced to a monomer composition comprising a) 45-75 wt. % of at least one monomer selected from i-amyl acrylate, n-heptyl acrylate, and 2-octyl acrylate, b) 24-50 wt. % of at least one alkyl (meth)acrylate, the alcohol component of which has 1 to 4 carbon atoms, and c) 0.5 to 10 wt. % of acrylic acid; and at least one adhesive force-enhancing resin. Also disclosed is an adhesive tape comprising a carrier material and the pressure-sensitive adhesive composition; and the use of the pressure-sensitive adhesive composition or the adhesive tape to produce adhesive bonds in electronic, optical and/or precision mechanical devices.

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