公开(公告)号：US20200079031A1

公开(公告)日：2020-03-12

申请号：US16567106

申请日：2019-09-11

Applicant: tesa SE

Inventor： Jannik SELLIN ,  Arne BARKLEY ,  Hans-Peter BRANDT ,  Manuel COLLAZO

IPC: B29C65/50 ,  B29C65/00 ,  C09J5/00 ,  C09J7/38 ,  C09J11/08 ,  C09J7/26 ,  G01L5/00

Abstract: Systems and methods transfer diecuts from a liner layer to a surface. One method may transfer a diecut from the liner layer to the surface by means of an applicator, wherein a ratio of the pull-off force of the diecut from the liner layer in the z direction to the pull-off force of the diecut from the surface in the z direction is at most 0.18. The method may enable particularly reliable and firm transfer of the diecut from a diecut tape to a surface where bonding is to take place. As a result, it may be possible for the frequency of errors in the bonding of plastics parts to be relevantly reduced.