公开(公告)号：US20240318054A1

公开(公告)日：2024-09-26

申请号：US18613753

申请日：2024-03-22

Applicant: tesa SE

Inventor： Julia Rompf ,  Ralf Kretzmer ,  Alexander Fischer ,  Kai Ellringmann ,  Bastian Wedel

IPC: C09J133/10 ,  C09J7/30 ,  C09J9/00

CPC classification number: C09J133/10 ,  C09J7/30 ,  C09J9/00 ,  C09J2301/414 ,  C09J2433/00

Abstract: An optically transparent adhesive compound, a process for producing it and an adhesive transfer tape comprising the adhesive compound. The present invention also relates to the use of the adhesive compound. The optically transparent adhesive compound is for bonding displays, holographic optical elements, lenses and glasses, including: 80 to 100% by weight of at least one (meth)acrylate-containing copolymer A, the copolymer A composed of 15 to 95% by weight of linear alkyl (meth)acrylate monomers, wherein the number of carbon atoms of the alkyl radicals of the linear alkyl (meth)acrylate monomers is 6 to 10, and 5 to 30% by weight of hydroxy group-containing (meth)acrylate monomers. Further, the adhesive compound has a haze value of less than 5% and a transmission at 400 nm to 800 nm of more than 90%, each measured according to ASTM D1003-13.

公开(公告)号：US11447669B2

公开(公告)日：2022-09-20

申请号：US16998508

申请日：2020-08-20

Applicant: TESA SE

Inventor： Thilo Dollase ,  Jessika Gargiulo ,  Marco Kupsky ,  Bastian Wedel

IPC: C09J133/06 ,  C09J11/06 ,  C09J7/22 ,  H01L51/52 ,  H01L51/56 ,  C08L33/06 ,  C09J7/38 ,  C09J5/06

Abstract: Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.