公开(公告)号：US07315119B2

公开(公告)日：2008-01-01

申请号：US10841755

申请日：2004-05-07

申请人： Kee Yean Ng ,  Kheng Leng Tan ,  Wen Ya Ou

发明人： Kee Yean Ng ,  Kheng Leng Tan ,  Wen Ya Ou

IPC分类号： H01J1/62

CPC分类号： C09K11/02 ,  C09K11/08 ,  H01L33/505 ,  H01L2224/48247 ,  H01L2224/73265

摘要： A light emitting device having a die that includes a light source that generates light of a first wavelength and a layer of phosphor particles covering the die is disclosed. The phosphor particles convert a portion of the light of the first wavelength to light of a second wavelength. The light source can be fabricated by attaching the light source to a substrate, and converting the light source by applying a light converting layer that includes a volatile carrier material and particles of a phosphor that convert light of the first wavelength to light of the second wavelength over the light source. The volatile carrier material is then caused to evaporate leaving a layer of the phosphor particles over the light source. A binder material can be incorporated in the volatile carrier for binding the phosphor particles to one another after the volatile carrier material is evaporated.

摘要翻译： 公开了一种具有芯片的发光器件，该裸片包括产生第一波长的光的光源和覆盖该裸片的荧光体粒子层。 荧光体颗粒将第一波长的光的一部分转换成第二波长的光。 光源可以通过将光源附着到基板上来制造，并且通过将包括挥发性载体材料的光转换层和将第一波长的光转换成第二波长的光的荧光体的颗粒来转换光源 在光源上。 然后使挥发性载体材料蒸发，在光源上留下一层荧光体颗粒。 在挥发性载体材料蒸发之后，可以将粘合剂材料引入挥发性载体中以将荧光体颗粒彼此粘合。

公开(公告)号：US08841597B2

公开(公告)日：2014-09-23

申请号：US12979071

申请日：2010-12-27

申请人： James Costello ,  Wee Sin Tan ,  Kai Koon Lee ,  Rani Saravanan

发明人： James Costello ,  Wee Sin Tan ,  Kai Koon Lee ,  Rani Saravanan

IPC分类号： H01J40/14 ,  H05K5/02 ,  G01J5/20

CPC分类号： G01D11/245

摘要： An optical proximity sensor and housing for the same are disclosed. The housing is provided with at least two support structures and at least two modules. A first of the support structures transfers vertical forces applied to one end of a module to an opposite end of the opposite module. A second of the support structures inhibits a pivoting of the modules about the first support structure.

摘要翻译： 公开了一种用于其的光学接近传感器和壳体。 壳体设置有至少两个支撑结构和至少两个模块。 支撑结构中的第一个将施加到模块的一端的垂直力传递到相对模块的相对端。 支撑结构中的第二个阻止了模块围绕第一支撑结构的枢转。