公开(公告)号：US09616650B2

公开(公告)日：2017-04-11

申请号：US14276589

申请日：2014-05-13

申请人： BOA-FRANC S.E.N.C.

发明人： Francois Roy

IPC分类号： B32B37/00 ,  B32B37/12 ,  B32B38/04 ,  B32B38/10 ,  B32B38/00

CPC分类号： B32B38/0004 ,  B32B37/12 ,  B32B38/10 ,  B32B2317/16 ,  B32B2471/00 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/1082 ,  Y10T428/24612

摘要： The described method of fabricating a composite engineered wood material floor board, having a top wood layer secured to a wood material substrate layer, minimizes the effect of telegraphy in the resulting floor board. The method includes selecting a top wood layer from a top surface quality wood material having a thickness of between 1 mm and 8 mm, and selecting a substrate wood material layer having a minimum thickness of 6 mm and a thickness ratio between 1:1 and 1:10 between the top wood layer and the substrate wood material layer. A plurality of transverse rectangular spaced-apart grooves are also formed in a bottom surface of said wood substrate layer. The ratio between the depth of said grooves and the thickness of the substrate wood material has an impact on telegraphy of said grooves in said top wood layer and is therefore selected accordingly.

公开(公告)号：US20140332153A1

公开(公告)日：2014-11-13

申请号：US14276589

申请日：2014-05-13

申请人： BOA-FRANC S.E.N.C.

发明人： Francois Roy

IPC分类号： B32B38/00

CPC分类号： B32B38/0004 ,  B32B37/12 ,  B32B38/10 ,  B32B2317/16 ,  B32B2471/00 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/1082 ,  Y10T428/24612

摘要： The described method of fabricating a composite engineered wood material floor board, having a top wood layer secured to a wood material substrate layer, minimizes the effect of telegraphy in the resulting floor board. The method includes selecting a top wood layer from a top surface quality wood material having a thickness of between 1 mm to 8 mm, and selecting a substrate wood material layer having a thickness of between 6 mm and a thickness ratio of 1 to no more than 10 between the top wood layer and the substrate wood material layer. A plurality of transverse rectangular spaced-apart grooves are also formed in a bottom surface of said wood substrate layer. The ratio between the depth of said grooves and the thickness of the substrate wood material has an impact on telegraphy of said grooves in said top wood layer and is therefore selected accordingly.

摘要翻译： 所描述的制造复合工程木材地板的方法，其具有固定到木材材料基底层的顶层木材层，最小化电路在所得到的地板中的影响。 该方法包括从厚度在1mm至8mm之间的顶表面质量的木材材料中选择顶部木材层，并且选择厚度在6mm和厚度比1之间的基材木质材料层不超过 10在顶层木材层和基材木材层之间。 多个横向矩形间隔开的槽也形成在所述木质基底层的底表面中。 所述凹槽的深度与基底木质材料的厚度之间的比例对所述顶部木材层中的所述凹槽的电报具有影响，因此被相应地选择。

公开(公告)号：US11364589B2

公开(公告)日：2022-06-21

申请号：US16448013

申请日：2019-06-21

申请人： BOA-FRANC, S.E.N.C.

发明人： Sébastien Roy ,  Jonathan Cloutier ,  Marie-Christine Ouellet

IPC分类号： B24C1/04 ,  G06T7/00 ,  B27G1/00 ,  G05B19/401 ,  G01N21/88

摘要： The method can include obtaining a digital image of a wood board having a defect, the digital image including a representation of the defect; using a computer: mapping the position and shape of the representation of the defect, and generating blasting instructions based on the mapped position and shape; positioning the wood board in a given position in a cleaning station, the cleaning station having a blasting nozzle and holding the wood board in its coordinate system; and the cleaning station automatically moving the blasting nozzle relative to the wood board and blasting the defect based on the blasting instructions, including moving at least one of the blasting nozzle and the wood board relative to a frame of the cleaning station.

公开(公告)号：US09487958B2

公开(公告)日：2016-11-08

申请号：US14121406

申请日：2014-09-02

申请人： BOA-FRANC S.E.N.C.

发明人： François Roy

IPC分类号： E04F15/04 ,  E04F15/02

CPC分类号： E04F15/042 ,  E04F15/02038 ,  E04F2201/0107

摘要： A composite engineered wood material piece, such as a floor board or wood material sheet, is comprised of a thin top quality wood material layer bonded onto a high density fiber board (HDF) material which is itself bonded onto a thick bottom substrate oriented strand board (OSB) material layer. The OSB material layer has its particle orientation in the top surface disposed parallel to the grain orientation in the top quality wood material layer. The HDF layer resists to the stress exhibited in the top layer and acts has a transition layer to secure the top layer to the bottom layer. It also strengthens the composite floor board or wood material sheet.

公开(公告)号：US20160060881A1

公开(公告)日：2016-03-03

申请号：US14121406

申请日：2014-09-02

申请人： BOA-FRANC S.E.N.C.

发明人： François Roy

IPC分类号： E04F15/04

CPC分类号： E04F15/042 ,  E04F15/02038 ,  E04F2201/0107

摘要： A composite engineered wood material piece, such as a floor board or wood material sheet, is comprised of a thin top quality wood material layer bonded onto a high density fiber board (HDF) material which is itself bonded onto a thick bottom substrate oriented strand board (OSB) material layer. The OSB material layer has its particle orientation in the top surface disposed parallel to the grain orientation in the top quality wood material layer. The HDF layer resists to the stress exhibited in the top layer and acts has a transition layer to secure the top layer to the bottom layer. It also strengthens the composite floor board or wood material sheet.

摘要翻译： 复合工程木质材料片，例如地板或木质材料片，由薄的顶级质量的木质材料层组成，该木质材料层粘合到高密度纤维板（HDF）材料上，该高密度纤维板本身结合到厚底部的基板定向的刨花板 （OSB）材料层。 OSB材料层的顶部表面中的颗粒取向平行于顶级木质材料层中的晶粒取向。 HDF层抵抗顶层中显示的应力，并且具有过渡层以将顶层固定到底层。 还可加强复合地板或木材板材。