公开(公告)号：US10094909B2

公开(公告)日：2018-10-09

申请号：US15663192

申请日：2017-07-28

Applicant: Humatics Corporation

Inventor： Gregory L. Charvat ,  David A. Mindell

IPC: G01S5/14 ,  G01S13/87 ,  H01Q1/24 ,  H04W4/02 ,  H01Q9/04 ,  H01Q1/22 ,  G01S5/02 ,  H04W56/00 ,  H01Q3/36 ,  H04B5/00 ,  H01Q9/26 ,  H01Q1/52 ,  H01Q9/27 ,  H01Q1/38 ,  H04W64/00 ,  H01Q5/10 ,  G01S11/02 ,  G01S13/00

Abstract: A device comprising: a substrate; a semiconductor die mounted on the substrate; a transmit antenna fabricated on the substrate and configured to transmit radio-frequency (RF) signals at least at a first center frequency; a receive antenna fabricated on the substrate and configured to receive RF signals at least at a second center frequency different than the first center frequency; and circuitry integrated with the semiconductor die and configured to provide RF signals to the transmit antenna and to receive RF signals from the receive antenna.