公开(公告)号：US09312059B2

公开(公告)日：2016-04-12

申请号：US14057900

申请日：2013-10-18

申请人： Pulse Electronics, Inc.

发明人： Thuyen Dinh ,  Mohammad Saboori ,  Mark Greene ,  Hamlet Abedmamoore

IPC分类号： H01F5/00 ,  H01F17/00 ,  H01F27/28 ,  H01F41/04 ,  H01F17/06

CPC分类号： H01F17/0033 ,  H01F5/00 ,  H01F17/06 ,  H01F27/28 ,  H01F41/04 ,  H01F41/046 ,  H01F2017/002 ,  Y10T29/4902

摘要： An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

摘要翻译： 改进的低成本和高度一致的感应装置。 在一个实施例中，低成本和高度一致的感应装置涉及在这些层压结构内发生的所谓的导电阳极细丝（CAF）。 这些条件包括高湿度，高偏压（即大电压差），高水分含量，表面和树脂离子杂质，玻璃与树脂粘合弱点和暴露于可能发生的高的组装温度，例如在无铅焊料 粘接应用。 在一个变型中，利用混合模式耦合技术来扩展衬底感应器件的底层工作带宽。 还公开了制造和使用上述衬底感应器件的方法。