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公开(公告)号：US20200260585A1
公开(公告)日：2020-08-13
申请号：US16865120
申请日：2020-05-01
摘要： Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.
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公开(公告)号：US11991829B2
公开(公告)日：2024-05-21
申请号：US16865120
申请日：2020-05-01
CPC分类号： H05K1/18 , H01F27/2823 , H01F27/2828 , H01F27/292 , H01F27/306 , H01F41/04 , H01F41/10
摘要： Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.
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3.发明申请SHIELDED INTEGRATED CONNECTOR MODULES AND ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME 有权屏蔽式集成连接器模块及组件及其制造方法公开(公告)号：US20130288526A1
公开(公告)日：2013-10-31
申请号：US13797527
申请日：2013-03-12
发明人： Thomas Rascon , Mohammad Saboori
IPC分类号： H01R13/6581
CPC分类号： H01R13/6581 , H01R13/514 , H01R13/6586 , H01R13/6658
摘要： High electrical isolation connector apparatus and methods. In one embodiment, an integrated connector module (ICM) is disclosed. The ICM includes a number of adjacent electronic subassemblies that are shielded through the use of an insert body shield. The insert body shield beneficially increases electrical isolation between adjacent subassemblies thereby further mitigating possible electrical noise. The insert body shield is configured to be received within a slot formed within the connector housing. An internal shield is also included that is received in a slot of an insert body of the electronic sub-assemblies, thereby effectively shielding adjacent component receiving cavities from one another. Methods and apparatus are also disclosed which make use and take advantage of these shielded ICMs. For example, telecommunications/networking equipment that incorporates these ICMs are also disclosed.
摘要翻译： 高电隔离连接器的设备和方法。 在一个实施例中，公开了集成连接器模块（ICM）。 ICM包括通过使用插入体屏蔽而被屏蔽的多个相邻的电子组件。 插入体屏蔽有利地增加相邻子组件之间的电隔离，从而进一步减轻可能的电噪声。 插入体屏蔽被配置为容纳在形成在连接器壳体内的槽内。 还包括内部屏蔽件，其被接收在电子子组件的插入体的狭槽中，从而有效地将相邻的部件容纳腔彼此屏蔽。 还公开了利用和利用这些屏蔽ICM的方法和装置。 例如，还公开了并入这些ICM的电信/网络设备。
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4.发明申请公开(公告)号：US20170004919A1
公开(公告)日：2017-01-05
申请号：US15199407
申请日：2016-06-30
CPC分类号： H05K1/18 , H01F27/2823 , H01F27/2828 , H01F27/292 , H01F27/306 , H01F41/10
摘要： Methods and apparatus for providing enhanced coupled inductive devices. In one embodiment, an inductive device is disclosed that is suitable in Ethernet applications with data speeds exceeding one (1) Gbps. Specifically, the inductive devices described herein possess a high level of magnetic and capacitive coupling between the wires of the windings. Moreover, the inductive devices described herein are suitable for automated processes, thereby reducing the overall costs associated with their manufacture and use. Furthermore, methods for manufacturing and using these aforementioned inductive devices are also disclosed. For example, the aforementioned inductive devices may readily be incorporated into ICMs thereby replacing, in their entirety or in part, manually wound toroidal transformers.
摘要翻译： 用于提供增强耦合感应装置的方法和装置。 在一个实施例中，公开了适用于数据速度超过一（1）Gbps的以太网应用的感应装置。 具体地说，这里描述的电感器件在绕组的电线之间具有高水平的磁性和电容耦合。 此外，本文所述的感应装置适用于自动化过程，从而降低与其制造和使用相关联的整体成本。 此外，还公开了用于制造和使用这些上述感应装置的方法。 例如，上述感应装置可容易地并入到ICM中，从而全部或部分地替代手动绕制的环形变压器。
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5.发明授权Shielded integrated connector modules and assemblies and methods of manufacturing the same 有权屏蔽的集成连接器模块和组件及其制造方法公开(公告)号：US09178318B2
公开(公告)日：2015-11-03
申请号：US13797527
申请日：2013-03-12
发明人： Thomas Rascon , Mohammad Saboori
IPC分类号： H01R13/648 , H01R13/6581 , H01R13/6586 , H01R13/514 , H01R13/66
CPC分类号： H01R13/6581 , H01R13/514 , H01R13/6586 , H01R13/6658
摘要： High electrical isolation connector apparatus and methods. In one embodiment, an integrated connector module (ICM) is disclosed. The ICM includes a number of adjacent electronic subassemblies that are shielded through the use of an insert body shield. The insert body shield beneficially increases electrical isolation between adjacent subassemblies thereby further mitigating possible electrical noise. The insert body shield is configured to be received within a slot formed within the connector housing. An internal shield is also included that is received in a slot of an insert body of the electronic sub-assemblies, thereby effectively shielding adjacent component receiving cavities from one another. Methods and apparatus are also disclosed which make use and take advantage of these shielded ICMs. For example, telecommunications/networking equipment that incorporates these ICMs are also disclosed.
摘要翻译： 高电隔离连接器的设备和方法。 在一个实施例中，公开了集成连接器模块（ICM）。 ICM包括通过使用插入体屏蔽而被屏蔽的多个相邻的电子组件。 插入体屏蔽有利地增加相邻子组件之间的电隔离，从而进一步减轻可能的电噪声。 插入体屏蔽被配置为容纳在形成在连接器壳体内的槽内。 还包括内部屏蔽件，其被接收在电子子组件的插入体的狭槽中，从而有效地将相邻的部件容纳腔彼此屏蔽。 还公开了利用和利用这些屏蔽ICM的方法和装置。 例如，还公开了并入这些ICM的电信/网络设备。
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公开(公告)号：US20140154920A1
公开(公告)日：2014-06-05
申请号：US13835217
申请日：2013-03-15
CPC分类号： H01F27/292 , H01F27/2823 , H01F2017/0093 , H01R13/6633 , Y10T29/49071
摘要： A chip choke assembly which reduces the loss of magnetic flux from the underlying core portions. In one embodiment, this reduction is achieved by producing a chip choke assembly comprised of two or more chip choke portions that collectively form a closed magnetic path. Additionally, the chip choke assembly disclosed herein also allows for adequate clearance between adjacent pads so as to avoid arcing during high potential voltage conditions. Methods for manufacturing and using the aforementioned chip choke assembly are also disclosed.
摘要翻译： 一种芯片扼流圈组件，其减小来自下面的芯部分的磁通量的损失。 在一个实施例中，通过制造由两个或更多个共同形成闭合磁路的芯片扼流圈部分组成的芯片扼流圈组件来实现该减小。 此外，本文公开的芯片阻抗组件还允许相邻焊盘之间的足够的间隙，以便在高电压电压条件下避免电弧。 还公开了制造和使用上述芯片阻塞组件的方法。
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公开(公告)号：US20200013534A1
公开(公告)日：2020-01-09
申请号：US16518874
申请日：2019-07-22
发明人： Thuyen Dinh , Mohammad Saboori , Aurelio Gutierrez , Collin Kneifl , Thomas Rascon , Farid Hamidy
IPC分类号： H01F17/04
摘要： Improved balance winding of electronic components including common-mode chokes and methods for using and manufacturing the same. In one embodiment, the common-mode choke includes a core and a pair of windings. The first winding and the second winding are alternatingly wound around the core with each respective winding being flipped at least once over the traverse direction of the winding barrel of the core. In one variant, the number of flips is dependent upon the core geometry, number of windings, and/or the specification limits on electrical balance. In another variant, the windings are first twisted and/or braided prior to being wound onto the winding barrel of the core.
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8.发明授权Integrated connector modules for extending transformer bandwidth with mixed-mode coupling using a substrate inductive device 有权集成连接器模块，用于通过使用基板感应装置的混合模式耦合来扩展变压器带宽公开(公告)号：US09312059B2
公开(公告)日：2016-04-12
申请号：US14057900
申请日：2013-10-18
发明人： Thuyen Dinh , Mohammad Saboori , Mark Greene , Hamlet Abedmamoore
CPC分类号： H01F17/0033 , H01F5/00 , H01F17/06 , H01F27/28 , H01F41/04 , H01F41/046 , H01F2017/002 , Y10T29/4902
摘要： An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.
摘要翻译： 改进的低成本和高度一致的感应装置。 在一个实施例中，低成本和高度一致的感应装置涉及在这些层压结构内发生的所谓的导电阳极细丝（CAF）。 这些条件包括高湿度，高偏压（即大电压差），高水分含量，表面和树脂离子杂质，玻璃与树脂粘合弱点和暴露于可能发生的高的组装温度，例如在无铅焊料 粘接应用。 在一个变型中，利用混合模式耦合技术来扩展衬底感应器件的底层工作带宽。 还公开了制造和使用上述衬底感应器件的方法。
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公开(公告)号：US20140125446A1
公开(公告)日：2014-05-08
申请号：US13797530
申请日：2013-03-12
CPC分类号： H01F17/0033 , H01F5/00 , H01F17/06 , H01F27/28 , H01F41/04 , H01F41/046 , H01F2017/002 , Y10T29/4902
摘要： An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.
摘要翻译： 改进的低成本和高度一致的感应装置。 在一个实施例中，低成本和高度一致的感应装置涉及在这些层压结构内发生的所谓的导电阳极细丝（CAF）。 这些条件包括高湿度，高偏压（即大电压差），高水分含量，表面和树脂离子杂质，玻璃与树脂粘合弱点和暴露于可能发生的高的组装温度，例如在无铅焊料 粘接应用。 还公开了制造和使用上述衬底感应器件的方法。
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公开(公告)号：US20180269633A1
公开(公告)日：2018-09-20
申请号：US15920224
申请日：2018-03-13
发明人： Thomas Rascon , Thuyen Dinh , Mohammad Saboori
IPC分类号： H01R13/6587 , H01R12/72
CPC分类号： H01R13/6587 , H01R12/721 , H01R12/724 , H01R13/6633 , H01R13/7175 , H01R24/64
摘要： An integrated connector module (ICM) is disclosed. In one embodiment, the ICM includes a plurality of shielding components, the plurality of shielding components comprising a port to port shield, an insert to insert shield and a main body shield. The ICM also contains one or more housing components, the one or more housing components comprising a plurality of ports that are arranged so as to be offset from a main signal conditioning portion of the one or more housing components; and an electronics assembly disposed within the one or more housing components. Methods and apparatus for utilizing and manufacturing the aforementioned ICM are also disclosed.
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