公开(公告)号：US12119165B2

公开(公告)日：2024-10-15

申请号：US17180086

申请日：2021-02-19

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Ye Ji Jung ,  Jae Hun Kim

IPC分类号： H01F27/29 ,  H01F17/00 ,  H01F27/32

CPC分类号： H01F27/292 ,  H01F17/0013 ,  H01F27/324 ,  H01F2017/002

摘要： A coil component includes: a body; a coil unit disposed in the body; a support substrate unit in contact with the coil unit to support the coil unit, and including first and second support substrates spaced apart from and oppose each other; and first and second external electrodes disposed on a first surface of the body and spaced apart from each other, and respectively connected to the coil unit.

公开(公告)号：US20240321497A1

公开(公告)日：2024-09-26

申请号：US18189910

申请日：2023-03-24

申请人： QUALCOMM Incorporated

发明人： Hsiao-Tsung YEN ,  Xingyi HUA ,  Jeongil Jay KIM

IPC分类号： H01F17/00 ,  H01L23/498

CPC分类号： H01F17/0013 ,  H01L23/49822 ,  H01L28/10 ,  H01F2017/002 ,  H01F2017/0086 ,  H01L24/16 ,  H01L2224/16227

摘要： An integrated device comprising a die substrate; and a die interconnection portion coupled to the die substrate. The die interconnection comprises a first inductor and a second inductor. The first inductor comprises a first spiral comprising a first origin and a first tail and a second spiral comprising a second origin and a second tail.

公开(公告)号：US20240186059A1

公开(公告)日：2024-06-06

申请号：US18207372

申请日：2023-06-08

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Mi Geum KIM ,  Jong Eun PARK ,  Sang Ik CHO ,  Mi Jung PARK ,  Yong Su LEE

IPC分类号： H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F27/32

CPC分类号： H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/324 ,  H01F2017/002 ,  H01F2017/048

摘要： A coil component includes a body having a first surface and a second surface opposing each other in a first direction, a support member disposed in the body, the support member having a first surface and a second surface opposing each other, a coil disposed on the support member, a pad portion disposed on the first surface of the support member to be connected to the coil, an external electrode disposed on the first surface of the body, and a via electrode connecting the pad portion and the external electrode to each other.

公开(公告)号：US20240145149A1

公开(公告)日：2024-05-02

申请号：US18469734

申请日：2023-09-19

申请人： Murata Manufacturing Co., Ltd.

发明人： Kenji TOYOSHIMA ,  Yoshimasa YOSHIOKA ,  Kouji YAMAUCHI

IPC分类号： H01F17/00 ,  H01F27/29

CPC分类号： H01F17/0013 ,  H01F27/292 ,  H01F2017/002

摘要： An inductor component includes an element body, a plurality of inductor wires, a plurality of columnar wires, and a plurality of outer electrodes. The plurality of inductor wires include a first inductor wire and a second inductor wire. The plurality of columnar wires include a plurality of first columnar wires and a plurality of second columnar wires. The plurality of outer electrodes include a plurality of first outer electrodes connected to the first columnar wires and a plurality of second outer electrodes connected to the second columnar wires. When viewed transparently in a direction orthogonal to a first principal surface, the first inductor wire has a portion overlapping the second outer electrodes.

公开(公告)号：US20240038429A1

公开(公告)日：2024-02-01

申请号：US17873785

申请日：2022-07-26

申请人： Texas Instruments Incorporated

发明人： Yi Yan ,  Vivek Arora

IPC分类号： H01F17/00 ,  H01F27/28 ,  H01L23/48 ,  H01L23/64

CPC分类号： H01F17/0033 ,  H01F17/0013 ,  H01F27/2804 ,  H01L23/481 ,  H01L23/645 ,  H01F2027/2809 ,  H01F2017/0086 ,  H01F2017/0073 ,  H01F2017/002

摘要： An electronic device with an integrated transformer including a first substrate having a first patterned conductive feature with multiple turns that form a first winding, and a first molded magnetic material that encloses a portion of the first patterned conductive feature, and an adhesive layer on a side of the first substrate. The transformer also includes a second substrate having a second patterned conductive feature with multiple turns that form a second winding, and a second molded magnetic material that encloses a portion of the second patterned conductive feature, the second substrate extending on the adhesive layer to magnetically couple the first and second windings. The electronic device includes a package structure that encloses the first and second substrates.

公开(公告)号：US20240006308A1

公开(公告)日：2024-01-04

申请号：US17855492

申请日：2022-06-30

申请人： QUALCOMM Incorporated

发明人： Kai LIU ,  Roy CHIU ,  Nosun PARK ,  Je-Hsiung LAN ,  Jonghae KIM

IPC分类号： H01L23/522 ,  H01L49/02 ,  H01L23/498 ,  H01F17/00

CPC分类号： H01L23/5227 ,  H01L23/5226 ,  H01L28/10 ,  H01L23/49827 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/002

摘要： A device comprising a die substrate, a plurality of interconnects located over the die substrate, wherein the plurality of interconnects are configured to operate as an inductor, at least one magnetic layer that surrounds at least part of the plurality of interconnects; and at least one dielectric layer that surrounds the at least one magnetic layer.

公开(公告)号：US11810703B2

公开(公告)日：2023-11-07

申请号：US16166227

申请日：2018-10-22

申请人： Murata Manufacturing Co., Ltd.

发明人： Yuki Ito

IPC分类号： H01F17/00 ,  H05K3/46 ,  H05K3/06 ,  H05K3/00 ,  H05K3/24 ,  H05K3/18 ,  H01F41/04 ,  H05K1/16 ,  H05K1/11 ,  H05K3/40

CPC分类号： H01F17/0013 ,  H01F41/041 ,  H05K1/165 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/06 ,  H05K3/18 ,  H05K3/188 ,  H05K3/24 ,  H05K3/46 ,  H05K3/4661 ,  H01F2017/002 ,  H05K1/115 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/064 ,  H05K3/4069 ,  H05K2201/0129 ,  H05K2203/0723 ,  H05K2203/107

摘要： A multilayer substrate includes an element assembly including a second insulating layer and a first insulating layer arranged in this order from a first side to a second side with respect to a layer stacking direction, a first conductor layer on the first side of the first insulating layer and including a plated layer, and a second conductor layer on the first side of the second insulating layer. The first conductor layer includes a first connection portion and a first circuit portion, and the second conductor layer includes a second connection portion and a second circuit portion. When viewed from the layer stacking direction, the first circuit portion includes an overlapping portion which overlaps the second circuit portion. A portion of the first connection portion connected to the second connection portion has a maximum thickness greater than a maximum thickness of the overlapping portion.

公开(公告)号：US11728084B2

公开(公告)日：2023-08-15

申请号：US18064905

申请日：2022-12-12

申请人： Murata Manufacturing Co., Ltd.

发明人： Yasunari Nakashima ,  Hiromi Miyoshi

IPC分类号： H01F27/29 ,  H01F17/00 ,  H01F27/28

CPC分类号： H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/002 ,  H01F2017/004 ,  H01F2017/0073

摘要： An inductor includes a coil that is provided in a component body. A first end of the coil is connected to a first outer electrode, and a second end of the coil is connected to a second outer electrode. The coil includes a plurality of coil conductor layers that are provided in a width direction. Each coil conductor layer is substantially spirally formed with the number of turns being greater than or equal to about one turn. The height of the component body is greater than the width of the component body.

公开(公告)号：US20230253138A1

公开(公告)日：2023-08-10

申请号：US18013103

申请日：2021-08-20

申请人： LG INNOTEK CO., LTD.

发明人： Bi Yi KIM ,  Yu Seon KIM ,  Seok BAE

IPC分类号： H01F17/00 ,  H01F27/28 ,  H01F27/24

CPC分类号： H01F17/0013 ,  H01F27/2804 ,  H01F27/24 ,  H01F2017/0073 ,  H01F2017/002 ,  H01F2027/065

摘要： An inductor according to an embodiment includes a core unit and a coil unit wherein a first coil unit includes a first upper conductive pattern and a first lower conductive pattern, wherein the second coil unit includes a second upper conductive pattern and a second lower conductive pattern, wherein the coil unit includes a center portion, a first pattern lead-out portion, and a second pattern lead-out portion, and wherein, in the second pattern lead-out portion, the second upper conductive pattern and the second lower conductive pattern overlap each other in a vertical direction such that at least a portion of the second upper conductive pattern and at least a portion of the second lower conductive pattern intersect each other when viewed in a plan view.

公开(公告)号：US11710995B2

公开(公告)日：2023-07-25

申请号：US16934872

申请日：2020-07-21

申请人： Infinitum Electric, Inc.

发明人： Rich Lee ,  Randal A. Lee ,  Paulo Guedes-Pinto

IPC分类号： H02K3/26 ,  H02K9/22 ,  H05K1/16 ,  H02K1/12 ,  H02K21/24 ,  H02K11/26 ,  H02K11/30 ,  H01F17/00 ,  H01F27/22 ,  H01F27/28 ,  H02K1/18 ,  H05K1/02 ,  H05K1/11

CPC分类号： H02K3/26 ,  H01F17/0013 ,  H01F27/22 ,  H01F27/2804 ,  H02K1/12 ,  H02K1/182 ,  H02K9/22 ,  H02K11/26 ,  H02K11/30 ,  H02K21/24 ,  H05K1/0201 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/165 ,  H01F2017/002 ,  H01F2017/0053 ,  H01F2027/2809 ,  H02K2203/03 ,  H02K2211/03 ,  H05K2201/093 ,  H05K2201/095 ,  H05K2201/10416

摘要： An axial field rotary energy device has a PCB stator panel assembly between rotors with an axis of rotation. Each rotor has a magnet. The PCB stator panel assembly includes PCB panels. Each PCB panel can have layers, and each layer can have conductive coils. The PCB stator panel assembly can have a thermally conductive layer that extends from an inner diameter portion to an outer diameter portion thereof. Each PCB panel comprises discrete, PCB radial segments that are mechanically and electrically coupled together to form the respective PCB panels.