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公开(公告)号：US09695603B2
公开(公告)日：2017-07-04
申请号：US14694863
申请日：2015-04-23
Applicant: SnapSports Company
Inventor： Jorgen J. Moller, Jr. , Jeremiah D. Shapiro
CPC classification number: E04F15/225 , E01C5/20 , E01C11/24 , E01C13/045 , E01C2201/12 , E01C2201/16 , E04F15/02022 , E04F15/022 , E04F15/10 , E04F15/105 , E04F15/22 , E04F2201/0146 , E04F2201/091 , E04F2201/095 , E04F2203/00 , Y10T29/49844
Abstract: Modular floor tiles and modular floors are described herein. A modular floor tile may include a top surface layer, a plurality of edge surfaces, an interlocking mechanism for attachment to adjacent tiles, and a support system. The support system may additionally include a first rigid level and at least one resilient support member disposed under the top surface layer, the at least one resilient support member extending to a distance further from the top surface layer than the first rigid level. The at least one resilient support member may be compressible toward the top surface layer. A modular floor may include a plurality of interlocking tiles connected to one another. A method of forming a modular floor that includes an interlocking modular tile is also disclosed.
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公开(公告)号：US20170016236A1
公开(公告)日：2017-01-19
申请号：US15277246
申请日：2016-09-27
Applicant: SnapSports Company
Inventor： Jorgen J. Moller, JR. , Jeremiah D. Shapiro
CPC classification number: E04F15/225 , A63B71/0054 , A63C19/04 , E04F15/02 , E04F15/02038 , E04F15/10 , E04F2201/0146 , E04F2201/021
Abstract: Modular floor tiles and modular floor systems are described herein. A floor tile system includes a modular floor tile and a plurality of resilient support assemblies. The modular floor tile includes a top surface layer having a top surface and a bottom surface and a plurality of rigid support portions extending from the bottom surface. The resilient support assemblies are supported against the bottom surface and include an outer resilient support portion having a hollow interior, and an inner resilient support portion positioned centrally relative to the outer resilient support portion.
Abstract translation: 本文描述了模块化地板砖和模块化地板系统。 地砖系统包括模块化地板砖和多个弹性支撑组件。 模块化地板砖包括具有顶表面和底表面的顶表面层和从底表面延伸的多个刚性支撑部分。 弹性支撑组件被支撑在底表面上并且包括具有中空内部的外部弹性支撑部分和相对于外部弹性支撑部分中心定位的内部弹性支撑部分。
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公开(公告)号：US09080333B2
公开(公告)日：2015-07-14
申请号：US14270204
申请日：2014-05-05
Applicant: SnapSports Company
Inventor： Jorgen J. Moller, Jr. , Jeremiah D. Shapiro
CPC classification number: E04F15/225 , E01C5/20 , E01C11/24 , E01C13/045 , E01C2201/12 , E01C2201/16 , E04F15/02022 , E04F15/022 , E04F15/10 , E04F15/105 , E04F15/22 , E04F2201/0146 , E04F2201/091 , E04F2201/095 , E04F2203/00 , Y10T29/49844
Abstract: Modular floor tiles and modular floors are described herein. A modular floor tile may include a top surface layer, a plurality of edge surfaces, an interlocking mechanism for attachment to adjacent tiles, and a support system. The support system may additionally include a first rigid level and at least one resilient support member disposed under the top surface layer, the at least one resilient support member extending to a distance further from the top surface layer than the first rigid level. The at least one resilient support member may be compressible toward the top surface layer. A modular floor may include a plurality of interlocking tiles connected to one another. A method of forming a modular floor that includes an interlocking modular tile is also disclosed.
Abstract translation: 本文描述了模块化地板砖和模块化地板。 模块化地板瓦可以包括顶表面层，多个边缘表面，用于附接到相邻瓦片的互锁机构和支撑系统。 支撑系统可以另外包括第一刚性水平和设置在顶表面层下方的至少一个弹性支撑构件，所述至少一个弹性支撑构件延伸到远离顶表面层比第一刚性水平更远的距离。 所述至少一个弹性支撑构件可朝向顶表面层压缩。 模块化地板可以包括彼此连接的多个互锁瓦片。 还公开了一种形成包括互锁模块瓦的模块化地板的方法。
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公开(公告)号：US09790691B2
公开(公告)日：2017-10-17
申请号：US15277246
申请日：2016-09-27
Applicant: SnapSports Company
Inventor： Jorgen J. Moller, Jr. , Jeremiah D. Shapiro
CPC classification number: E04F15/225 , A63B71/0054 , A63C19/04 , E04F15/02 , E04F15/02038 , E04F15/10 , E04F2201/0146 , E04F2201/021
Abstract: Modular floor tiles and modular floor systems are described herein. A floor tile system includes a modular floor tile and a plurality of resilient support assemblies. The modular floor tile includes a top surface layer having a top surface and a bottom surface and a plurality of rigid support portions extending from the bottom surface. The resilient support assemblies are supported against the bottom surface and include an outer resilient support portion having a hollow interior, and an inner resilient support portion positioned centrally relative to the outer resilient support portion.
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公开(公告)号：US20160010343A1
公开(公告)日：2016-01-14
申请号：US14854338
申请日：2015-09-15
Applicant: SnapSports Company
Inventor： Jorgen J. Moller, JR. , Jeremiah D. Shapiro
CPC classification number: E04F15/225 , A63B71/0054 , A63C19/04 , E04F15/02 , E04F15/02038 , E04F15/10 , E04F2201/0146 , E04F2201/021
Abstract: Modular floor tiles and modular floor systems are described herein. A floor tile system includes a modular floor tile and a plurality of resilient support assemblies. The modular floor tile includes a top surface layer having a top surface and a bottom surface and a plurality of rigid support portions extending from the bottom surface. The resilient support assemblies are supported against the bottom surface and include an outer resilient support portion having a hollow interior, and an inner resilient support portion positioned centrally relative to the outer resilient support portion.
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Patent Agency Ranking
公开(公告)号：US20130180195A1
公开(公告)日：2013-07-18
申请号：US13784673
申请日：2013-03-04
Applicant: SnapSports Company
Inventor： Jorgen J. Moller, JR. , Jeremiah D. Shapiro
IPC: E04F15/22
CPC classification number: E04F15/225 , E01C5/20 , E01C11/24 , E01C13/045 , E01C2201/12 , E01C2201/16 , E04F15/02022 , E04F15/022 , E04F15/10 , E04F15/105 , E04F15/22 , E04F2201/0146 , E04F2201/091 , E04F2201/095 , E04F2203/00 , Y10T29/49844
Abstract: Modular floor tiles and modular floors are described herein. A modular floor tile may include a top surface layer, a plurality of edge surfaces, an interlocking mechanism for attachment to adjacent tiles, and a support system. The support system may additionally include a first rigid level and at least one resilient support member disposed under the top surface layer, the at least one resilient support member extending to a distance further from the top surface layer than the first rigid level. The at least one resilient support member may be compressible toward the top surface layer. A modular floor may include a plurality of interlocking tiles connected to one another. A method of forming a modular floor that includes an interlocking modular tile is also disclosed.
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公开(公告)号：US08099915B2
公开(公告)日：2012-01-24
申请号：US12252168
申请日：2008-10-15
Applicant: Jorgen J. Moller, Jr. , Jeremiah D. Shapiro
Inventor： Jorgen J. Moller, Jr. , Jeremiah D. Shapiro
IPC: E04F15/02
CPC classification number: E04F15/225 , E01C5/20 , E01C11/24 , E01C13/045 , E01C2201/12 , E01C2201/16 , E04F15/02022 , E04F15/022 , E04F15/10 , E04F15/105 , E04F15/22 , E04F2201/0146 , E04F2201/091 , E04F2201/095 , E04F2203/00 , Y10T29/49844
Abstract: Modular floor tiles and modular floors are described herein. A modular floor tile may include a top surface layer, a plurality of edge surfaces, an interlocking mechanism for attachment to adjacent tiles, and a support system. The support system may additionally include a first rigid level and at least one resilient support member disposed under the top surface layer, the at least one resilient support member extending to a distance further from the top surface layer than the first rigid level. The at least one resilient support member may be compressible toward the top surface layer. A modular floor may include a plurality of interlocking tiles connected to one another. A method of forming a modular floor that includes an interlocking modular tile is also disclosed.
Abstract translation: 本文描述了模块化地板砖和模块化地板。 模块化地板瓦可以包括顶表面层，多个边缘表面，用于附接到相邻瓦片的互锁机构和支撑系统。 支撑系统可以另外包括第一刚性水平和设置在顶表面层下方的至少一个弹性支撑构件，所述至少一个弹性支撑构件延伸到距离顶表面层比第一刚性水平更远的距离。 所述至少一个弹性支撑构件可朝向顶表面层压缩。 模块化地板可以包括彼此连接的多个互锁瓦片。 还公开了一种形成包括互锁模块瓦的模块化地板的方法。
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公开(公告)号：US09909323B2
公开(公告)日：2018-03-06
申请号：US15786227
申请日：2017-10-17
Applicant: SnapSports Company
Inventor： Jorgen J. Moller, Jr. , Jeremiah D. Shapiro
CPC classification number: E04F15/225 , A63B71/0054 , A63C19/04 , E04F15/02 , E04F15/02038 , E04F15/10 , E04F2201/0146 , E04F2201/021
Abstract: Modular floor tiles and modular floor systems are described herein. A floor tile system includes a modular floor tile and a plurality of resilient support assemblies. The modular floor tile includes a top surface layer having a top surface and a bottom surface and a plurality of rigid support portions extending from the bottom surface. The resilient support assemblies are supported against the bottom surface and include an outer resilient support portion having a hollow interior, and an inner resilient support portion positioned centrally relative to the outer resilient support portion.
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公开(公告)号：US20150225965A1
公开(公告)日：2015-08-13
申请号：US14694863
申请日：2015-04-23
Applicant: SnapSports Company
Inventor： Jorgen J. Moller, JR. , Jeremiah D. Shapiro
IPC: E04F15/22 , E04F15/022 , E04F15/02
CPC classification number: E04F15/225 , E01C5/20 , E01C11/24 , E01C13/045 , E01C2201/12 , E01C2201/16 , E04F15/02022 , E04F15/022 , E04F15/10 , E04F15/105 , E04F15/22 , E04F2201/0146 , E04F2201/091 , E04F2201/095 , E04F2203/00 , Y10T29/49844
Abstract: Modular floor tiles and modular floors are described herein. A modular floor tile may include a top surface layer, a plurality of edge surfaces, an interlocking mechanism for attachment to adjacent tiles, and a support system. The support system may additionally include a first rigid level and at least one resilient support member disposed under the top surface layer, the at least one resilient support member extending to a distance further from the top surface layer than the first rigid level. The at least one resilient support member may be compressible toward the top surface layer. A modular floor may include a plurality of interlocking tiles connected to one another. A method of forming a modular floor that includes an interlocking modular tile is also disclosed.
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公开(公告)号：US20140237916A1
公开(公告)日：2014-08-28
申请号：US14270204
申请日：2014-05-05
Applicant: SnapSports Company
Inventor： Jorgen J. Moller, JR. , Jeremiah D. Shapiro
IPC: E04F15/10
CPC classification number: E04F15/225 , E01C5/20 , E01C11/24 , E01C13/045 , E01C2201/12 , E01C2201/16 , E04F15/02022 , E04F15/022 , E04F15/10 , E04F15/105 , E04F15/22 , E04F2201/0146 , E04F2201/091 , E04F2201/095 , E04F2203/00 , Y10T29/49844
Abstract: Modular floor tiles and modular floors are described herein. A modular floor tile may include a top surface layer, a plurality of edge surfaces, an interlocking mechanism for attachment to adjacent tiles, and a support system. The support system may additionally include a first rigid level and at least one resilient support member disposed under the top surface layer, the at least one resilient support member extending to a distance further from the top surface layer than the first rigid level. The at least one resilient support member may be compressible toward the top surface layer. A modular floor may include a plurality of interlocking tiles connected to one another. A method of forming a modular floor that includes an interlocking modular tile is also disclosed.
Abstract translation: 本文描述了模块化地板砖和模块化地板。 模块化地板瓦可以包括顶表面层，多个边缘表面，用于附接到相邻瓦片的互锁机构和支撑系统。 支撑系统可以另外包括第一刚性水平和设置在顶表面层下方的至少一个弹性支撑构件，所述至少一个弹性支撑构件延伸到远离顶表面层比第一刚性水平更远的距离。 所述至少一个弹性支撑构件可朝向顶表面层压缩。 模块化地板可以包括彼此连接的多个互锁瓦片。 还公开了一种形成包括互锁模块瓦的模块化地板的方法。
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