公开(公告)号：US11652286B2

公开(公告)日：2023-05-16

申请号：US16892282

申请日：2020-06-03

Applicant: Space Exploration Technologies Corp.

Inventor： David Milroy ,  Samuel Belden

IPC: H01Q1/02 ,  H01Q1/42 ,  H01Q9/04 ,  H01Q1/12 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q23/00 ,  H01Q15/14 ,  H01Q21/06 ,  H01Q21/10 ,  H01Q21/00

CPC classification number: H01Q1/428 ,  H01Q1/02 ,  H01Q1/1207 ,  H01Q1/1228 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/422 ,  H01Q9/0407 ,  H01Q9/0414 ,  H01Q15/144 ,  H01Q21/00 ,  H01Q21/065 ,  H01Q21/10 ,  H01Q23/00 ,  H01Q1/2291

Abstract: In one embodiment of the present disclosure, an antenna assembly includes a plurality of layers defining an antenna assembly including a plurality of PCB layers and a plurality of non-PCB layers, the antenna assembly having a top surface and a bottom surface, and adhesive coupling between the PCB layers and the non-PCB layers.