摘要:
An apparatus and a method is provided for using high-frequency acoustic energy with a supercritical fluid to perform a semiconductor wafer (“wafer”) cleaning process. High-frequency acoustic energy is applied to the supercritical fluid to impart energy to particulate contamination present on the wafer surface. Energy imparted to particulate contamination via the high-frequency acoustic energy and supercritical fluid is used to dislodge and remove the particulate contamination from the wafer. Additionally, the wafer cleaning process benefits from the supercritical fluid properties of near zero surface tension, high diffusivity, high density, and chemical mixing capability.
摘要:
In a device for selectively cleaning, disinfecting and maintaining medical or dental instruments, particularly tool holders, with a washing container to accommodate at least one instrument and with an ultrasonic cleaning device with an ultrasonic exciter which is arranged on the washing container, the washing container has a cross-sectional shape, preferably a horizontal cross-sectional shape, which deviates from a rectangular or square cross-sectional shape.