公开(公告)号：US20020014574A1

公开(公告)日：2002-02-07

申请号：US09935549

申请日：2001-08-24

申请人： Mitsubishi Materials Corporation

发明人： Saburo Wakita ,  Akira Mitsuhashi ,  Jun-ichi Sasaki

IPC分类号： C09D001/02 ,  B28B007/28 ,  B28B007/34 ,  C04B028/26 ,  C04B035/66 ,  B22D019/00 ,  B22D007/06 ,  B22D007/10 ,  B22D041/14 ,  B22D041/16 ,  B22D041/22 ,  B22D041/44

CPC分类号： C30B11/002

摘要： A mold for producing a silicon ingot having a layered structure comprising an inner silica layer containing at least one layer in which a fused silica powder with a particle size of 100 nullm or less and a fine fused silica sand with a particle size of 100-300 nullm is bonded with a silica binder, and an outer silica layer containing at least one layer in which a fused silica powder with a particle size of 100 nullm or less and a coarse fused silica sand with a particle size of 500-1500 nullm is bonded with a silica binder.