公开(公告)号：US07534283B2

公开(公告)日：2009-05-19

申请号：US11377249

申请日：2006-03-17

申请人： Tomoya Yamada ,  Koji Hirata

发明人： Tomoya Yamada ,  Koji Hirata

IPC分类号： B22F8/24

CPC分类号： B22F9/24 ,  C22B15/0021

摘要： A method of producing copper powder is provided that uses electrolytic cuprous oxide as the starting material for the production of copper powder suitable for a conductive filler whose particles have an average particle diameter of not greater than 1 μm or even not greater than 0.5 μm and are of uniform size. In one aspect, the method comprises a step of mixing cuprous oxide with a reducing agent in a liquor in which a protective colloid is present and to which a water-soluble copper salt has been added and in another aspect comprises a step of reducing a water-soluble copper salt in a liquor in which a protective colloid is present, thereby forming a slurry, and a step of reducing cuprous oxide in the presence of the slurry. As the water-soluble copper salt can be used, for example, 0.1-20 moles of a monovalent copper salt such as cuprous chloride per 100 moles of the cuprous oxide. As the protective colloid can be used 1-40 parts by mass of a water-soluble polymer per 100 parts by mass of the cuprous oxide.

摘要翻译： 提供一种制造铜粉的方法，其使用电解氧化亚铜作为生产适用于其颗粒的平均粒径不大于1μm或甚至不大于0.5μm的导电填料的铜粉的起始材料，并且是 均匀的大小。 一方面，该方法包括在存在保护胶体的液体中将氧化亚铜与还原剂混合并且已加入水溶性铜盐的步骤，另一方面包括降低水的步骤 在其中存在保护胶体的液体中，从而形成浆料，以及在浆料存在下还原氧化亚铜的步骤。 可以使用水溶性铜盐，例如每100摩尔氧化亚铜0.1-20摩尔的一价铜盐如氯化亚铜。 作为保护胶体，相对于100质量份的氧化亚铜，可以使用1-40质量份的水溶性聚合物。