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    Flux composition and soldering method for high density arrays
    1.
    发明授权
    Flux composition and soldering method for high density arrays 有权
    高密度阵列的焊剂组成和焊接方法

    公开(公告)号：US06550667B2

    公开(公告)日：2003-04-22

    申请号：US09726697

    申请日：2000-11-29

    申请人： William E. Bernier ,  Donald W. Henderson ,  James Spalik

    发明人： William E. Bernier ,  Donald W. Henderson ,  James Spalik

    IPC分类号： B23K35362

    CPC分类号： B23K35/3618 ,  B23K35/3612 ,  B23K35/3617 ,  H05K3/3489

    摘要： A single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent having a higher evaporation temperature than that of said first organic solvent. Preferred dicarboxylic acids are adipic, pimelic, suberic, azelaic and sebacic acids. Preferably, the composition comprises greater than 6% dicarboxylic acid, more preferably greater that 6% to about 15%, and even more preferably from about 8% to about 10% of the dicarboxylic acid. Preferred amounts of the first organic solvent are in the range of from about 25% to about 75% by weight and preferred amounts of the second organic solvent are from about 10% to about 35% by weight. Preferably, the ratio of the first organic solvent to the second organic solvent is about 3:1. A method for using the inventive composition to solder high density arrays which, for eutectic lead/tin solder, involves heating at extended dwell times and high temperature relative to typical compositions.

    摘要翻译： 适用于高密度阵列的单相通量组合物，其包含足以与高密度阵列中的氧化表面积反应的二羧酸，第一有机溶剂和具有较高蒸发温度的第二有机溶剂 比所述第一有机溶剂的。 优选的二羧酸是己二酸，庚二酸，辛二酸，壬二酸和癸二酸。 优选地，组合物包含大于6％的二羧酸，更优选大于6％至约15％，甚至更优选约8％至约10％的二羧酸。 第一有机溶剂的优选量为约25重量％至约75重量％，优选的第二有机溶剂的量为约10重量％至约35重量％。 优选地，第一有机溶剂与第二有机溶剂的比例为约3:1。 使用本发明组合物来焊接高密度阵列的方法，对于共晶铅/锡焊料，其涉及相对于典型组合物在延长的停留时间和高温下加热。

    Deferrizing flux salt composition for flux baths
    2.
    发明授权
    Deferrizing flux salt composition for flux baths 有权
    助焊剂槽的助焊剂盐组合物的脱铁

    公开(公告)号：US06802912B2

    公开(公告)日：2004-10-12

    申请号：US10196654

    申请日：2002-07-15

    申请人： Georg Bogar ,  Helmut Herwig ,  Harald Ernst

    发明人： Georg Bogar ,  Helmut Herwig ,  Harald Ernst

    IPC分类号： B23K35362

    CPC分类号： C23C2/30

    摘要： The invention relates to a flux salt composition for flux baths which is available for particularly simple regeneration and deferrizing. The deferrizing flux salt composition for flux baths, containing zinc chloride and alkali metal chloride, contains at least one or more alkalizing constituents and one or more constituents which, in aqueous solution, oxidize iron(II) to form iron(III).

    摘要翻译： 本发明涉及用于焊剂浴的焊剂盐组合物，其可用于特别简单的再生和脱铁。用于含有氯化锌和碱金属氯化物的焊剂浴的脱硫助熔剂组合物含有至少一种或多种碱化组分和一种或多种 在水溶液中氧化铁（II）以形成铁（III）的成分。

    Flux for brazing difficult to wet metallic materials
    4.
    发明授权
    Flux for brazing difficult to wet metallic materials 失效
    钎焊助焊剂难以润湿金属材料

    公开(公告)号：US06613159B1

    公开(公告)日：2003-09-02

    申请号：US09565482

    申请日：2000-05-05

    申请人： Jürgen Koch ,  Sandra Wittpahl ,  Wolfgang Weber ,  Wolfgang Kohlweiler

    发明人： Jürgen Koch ,  Sandra Wittpahl ,  Wolfgang Weber ,  Wolfgang Kohlweiler

    IPC分类号： B23K35362

    CPC分类号： B23K35/3606 ,  B23K35/025 ,  B23K35/3605

    摘要： A flux based on inorganic boron and/or halogen compounds for brazing difficult to wet metallic materials with silver- and copper-based solders, which contains, as an activating addition, based on the total amount of the flux, 0.01-10 wt. % of elemental boron and 0.01-10 wt. % of at least one of the elements Mo, W, Mn, Co, Ni, Pd, Cu or Ag in the form of elements, alloys or compounds. The activating addition brings about a substantial increase in the wettability by the solder, particularly in the case of difficult to wet stock materials.

    摘要翻译： 基于无机硼和/或卤素化合物的焊剂，用于钎焊难以用金属和铜基焊料浸湿的金属材料，其包含作为活化添加剂，基于焊剂的总量，0.01-10重量％ 元素硼的百分比和0.01-10重量％ 元素，合金或化合物形式的元素Mo，W，Mn，Co，Ni，Pd，Cu或Ag中的至少一种元素的％。 活化添加物导致焊料的润湿性显着增加，特别是在难以浸湿的原料的情况下。