GAS ORIFICE HOLDER
    2.
    发明申请
    GAS ORIFICE HOLDER 审中-公开
    气体配件架

    公开(公告)号:US20150198336A1

    公开(公告)日:2015-07-16

    申请号:US14152293

    申请日:2014-01-10

    申请人: Jürgen Koch

    IPC分类号: F24C3/12 F24C3/10 F24C3/08

    摘要: A gas orifice holder for a gas burner includes a gas orifice and a solenoid valve. The solenoid valve is positioned between a gas inlet and the orifice for controlling the gas flow to the orifice.

    摘要翻译: 用于气体燃烧器的气体孔保持器包括气体孔和电磁阀。 电磁阀位于气体入口和孔之间,用于控制气体流向孔口。

    Transparent, tough and rigid molding compositions based on styrene-butadiene block copolymer mixtures
    3.
    发明授权
    Transparent, tough and rigid molding compositions based on styrene-butadiene block copolymer mixtures 失效
    基于苯乙烯 - 丁二烯嵌段共聚物混合物的透明,坚韧和刚性的模塑组合物

    公开(公告)号:US08575269B2

    公开(公告)日:2013-11-05

    申请号:US12677960

    申请日:2008-09-03

    IPC分类号: C08L53/02 B32B3/12 B32B1/08

    摘要: A mixture which contains a) a copolymer or block copolymer A comprising one or more copolymer blocks (B/S)A which are respectively composed of from 65 to 95% by weight of vinylaromatic monomers and of from 35 to 5% by weight of dienes, and whose glass transition temperature TgA is in the range from 40° to 90° C., b) a block copolymer B comprising at least one hard block S which is composed of vinylaromatic monomers, and comprising one or more copolymer blocks (B/S)B which are respectively composed of from 20 to 60% by weight of vinylaromatic monomers and of from 80 to 40% by weight of dienes, and whose glass transition temperature TgB is in the range from −70° to 0° C., c) a polystyrene C, and its use for the production of packaging for electronics components.

    摘要翻译: 包含a)共聚物或嵌段共聚物A的组合物,其包含一种或多种共聚物嵌段(B / S)A,它们分别由65至95重量%的乙烯基芳族单体和35至5重量%的二烯 并且其玻璃化转变温度TgA在40℃至90℃的范围内,b)嵌段共聚物B,其包含至少一个由乙烯基芳族单体组成的硬质块S,并且包含一个或多个共聚物嵌段(B / S)B,其分别由20至60重量%的乙烯基芳族单体和80至40重量%的二烯组成,并且其玻璃化转变温度TgB在-70℃至0℃的范围内, c)聚苯乙烯C及其用于生产电子元件包装的用途。

    Gas stove burner with simmer flame
    4.
    发明授权
    Gas stove burner with simmer flame 失效
    燃气灶燃烧器带有火焰

    公开(公告)号:US06780008B2

    公开(公告)日:2004-08-24

    申请号:US10439980

    申请日:2003-05-16

    IPC分类号: F23D1462

    摘要: A gas stove burner has a base defining an axis and a ring assembly sitting on the base, forming therewith an annular outer compartment and a central inner compartment, and formed with an array of outwardly open lower passages open radially inward into the outer compartment. A generally imperforate cover disk overlying the ring assembly has an outer edge, upwardly closes the inner compartment, and forms with the ring assembly an array of upper passages open radially inward into the inner compartment and radially outward at the disk outer edge. Inlets on the base feed respective gas/air mixtures to the compartments and form a main flame at the edge from the mixture exiting the lower passages and a simmer flame at the edge from the mixture exiting the upper passages.

    摘要翻译: 气体燃烧器具有限定轴线的基座和位于基座上的环组件,与其形成环形的外部隔室和中央内部隔室,并且形成有向外敞开的下部通道的阵列,径向向内打开进入外部隔间。 覆盖环组件的通常无孔的盖盘具有外边缘,向上关闭内隔室,并与环组件形成上部通道阵列,径向向内打开进入内隔室并且在盘外边缘处径向向外敞开。 基座上的入口将相应的气体/空气混合物供给到隔室,并在离开下通道的混合物的边缘处形成主火焰,并在离开上通道的混合物的边缘处形成火焰。

    Soldering paste for hard-soldering and coating aluminum and aluminum alloys
    5.
    发明授权
    Soldering paste for hard-soldering and coating aluminum and aluminum alloys 失效
    焊膏用于硬焊和涂铝和铝合金

    公开(公告)号:US06656290B1

    公开(公告)日:2003-12-02

    申请号:US09115553

    申请日:1998-07-15

    IPC分类号: B23K3534

    摘要: A soldering paste for hard-soldering and coating working parts made of aluminum or aluminum alloys, which contains 25 to 35 percent in weight of a water-miscible organic binding agent on the basis of aliphatic glycols, 25 to 45 percent in weight of an aluminum hard-soldering powder, 25 to 45 percent in weight of an aluminum fluxing agent and, as an additive to influence the rheological properties, 0.01 to 0.2 percent by weight with respect to the total amount of one or several fatty acids with 10 to 20 C atoms and/or their ammonium salts.

    摘要翻译: 用于硬焊接和涂覆由铝或铝合金制成的工作部件的焊膏,其包含基于脂族二醇的25至35重量%的水混溶性有机粘合剂,25至45重量%的铝 硬钎焊粉末,25〜45重量%的铝助熔剂,作为影响流变性能的添加剂,相对于10〜20℃的一种或几种脂肪酸的总量,为0.01〜0.2重量% 原子和/或其铵盐。

    Flux for brazing difficult to wet metallic materials
    6.
    发明授权
    Flux for brazing difficult to wet metallic materials 失效
    钎焊助焊剂难以润湿金属材料

    公开(公告)号:US06613159B1

    公开(公告)日:2003-09-02

    申请号:US09565482

    申请日:2000-05-05

    IPC分类号: B23K35362

    摘要: A flux based on inorganic boron and/or halogen compounds for brazing difficult to wet metallic materials with silver- and copper-based solders, which contains, as an activating addition, based on the total amount of the flux, 0.01-10 wt. % of elemental boron and 0.01-10 wt. % of at least one of the elements Mo, W, Mn, Co, Ni, Pd, Cu or Ag in the form of elements, alloys or compounds. The activating addition brings about a substantial increase in the wettability by the solder, particularly in the case of difficult to wet stock materials.

    摘要翻译: 基于无机硼和/或卤素化合物的焊剂,用于钎焊难以用金属和铜基焊料浸湿的金属材料,其包含作为活化添加剂,基于焊剂的总量,0.01-10重量% 元素硼的百分比和0.01-10重量% 元素,合金或化合物形式的元素Mo,W,Mn,Co,Ni,Pd,Cu或Ag中的至少一种元素的%。 活化添加物导致焊料的润湿性显着增加,特别是在难以浸湿的原料的情况下。

    Soldering paste for producing geometrical metal structures with precise contours
    7.
    发明授权
    Soldering paste for producing geometrical metal structures with precise contours 失效
    用于生产具有精确轮廓的几何金属结构的焊膏

    公开(公告)号:US06207300B1

    公开(公告)日:2001-03-27

    申请号:US09381269

    申请日:1999-12-08

    IPC分类号: B05D132

    摘要: A process for producing, on a metallic substrate, a geometric metal structure having a precise contour, including the steps of: solder coating a solder paste onto the substrate by screen printing to create the geometric metal structure, the solder paste comprising an organic binder system, and 80 to 95 weight % of a mixture of a nickel-based solder and a pulverulent alloy of nickel with at least one member selected from the group consisting of chromium, molybdenum, tungsten, manganese and iron, provided as a higher-melting metallic filler, wherein a weight ratio of solder to filler is 2-6:1, an average grain size of the solder is between 10 and 50 &mgr;m, and a grain size ratio of solder to filler, relative to the average grain size is from 0.5-2.5:1; drying the structure; decomposing the organic binder system present in the solder paste, without leaving a reside, by a heat treatment; and raising the temperature until the resulting solder material liquifies.

    摘要翻译: 一种在金属基板上制造具有精确轮廓的几何金属结构的方法,包括以下步骤:通过丝网印刷将焊膏涂覆到基底上以产生几何金属结构,所述焊膏包括有机粘合剂体系 ,以及80至95重量%的镍基焊料和镍粉末合金与选自铬,钼,钨,锰和铁中的至少一种的混合物,作为高熔点金属 填料,其中焊料与填料的重量比为2-6:1,焊料的平均粒径为10〜50μm,焊料与填料的相对于平均粒径的粒径比为0.5 -2.5:1; 干燥结构; 通过热处理分解存在于焊膏中的有机粘合剂体系,而不留下; 并升高温度直到得到的焊料物质液化。

    PHASE-SEPARATING BLOCK COPOLYMERS COMPOSED OF INCOMPATIBLE HARD BLOCKS AND MOLDING MATERIALS WITH HIGH STIFFNESS
    9.
    发明申请
    PHASE-SEPARATING BLOCK COPOLYMERS COMPOSED OF INCOMPATIBLE HARD BLOCKS AND MOLDING MATERIALS WITH HIGH STIFFNESS 审中-公开
    组成不可分割硬块的相分离块状共聚物和具有高刚度的成型材料

    公开(公告)号:US20110257335A1

    公开(公告)日:2011-10-20

    申请号:US13141840

    申请日:2009-12-14

    IPC分类号: C08L53/02 C08F279/00

    摘要: A block copolymer with weight-average molar mass Mw of at least 100 000 g/mol, comprisinga) at least one block S composed of from 95 to 100% by weight of vinylaromatic monomers and from 0 to 5% by weight of dienes, andb) at least one copolymer block (S/B)A composed of from 63 to 80% by weight of vinylaromatic monomers and from 20 to 37% by weight of dienes, with glass transition temperature TgA in the range from 5 to 30° C., andc) at least one copolymer block (S/B)B composed of from 20 to 60% by weight of vinylaromatic monomers and from 40 to 80% by weight of dienes, with glass transition temperature TgB in the range from 0 to −80° C.,where the proportion by weight of the entirety of all of the blocks S is in the range from 50 to 70% by weight, and the proportion by weight of the entirety of all of the blocks (S/B)A and (S/B)B is in the range from 30 to 50% by weight, based in each case on the block copolymer A, and also mixtures thereof, and their use.

    摘要翻译: 一种重均摩尔质量Mw至少为100000g / mol的嵌段共聚物,包含a)至少一种由95-100%(重量)乙烯基芳族单体和0-5%(重量)二烯组成的嵌段S, 和b)由63至80重量%的乙烯基芳族单体和20至37重量%的二烯组成的至少一种共聚物嵌段(S / B)A,玻璃化转变温度TgA在5至30℃的范围内 C)和c)由20至60重量%的乙烯基芳族单体和40至80重量%的二烯组成的至少一种共聚物嵌段(S / B)B,玻璃化转变温度TgB为0 至-80℃,其中全部块S的重量比例在50至70重量%的范围内,并且全部块的重量比(S / B )A和(S / B)B在30至50重量%的范围内,基于嵌段共聚物A的每种情况,以及它们的混合物及其用途。