公开(公告)号：US06358118B1

公开(公告)日：2002-03-19

申请号：US09608462

申请日：2000-06-30

申请人： Robert G. Boehm ,  John M. Boyd

发明人： Robert G. Boehm ,  John M. Boyd

IPC分类号： B24B4916

CPC分类号： B24B37/20 ,  B24B1/005 ,  B24B49/16 ,  B24D9/08

摘要： A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.

摘要翻译： 抛光工具包括抛光垫，气囊，流体和通量引导件。 含膀胱的流体支撑抛光垫，该抛光垫邻近被抛光表面定位。 沿着膀胱的一部分定位的通量引导件将场或磁通量引导到膀胱的选定位置。 抛光表面的方法调整从引导件发出的磁场或磁通，其改变流体的机械性能。 通过调节磁通量的磁场强度或磁通量的水平，独立的压力调节发生在控制表面的抛光轮廓的气囊的选定位置处。

公开(公告)号：US06561870B2

公开(公告)日：2003-05-13

申请号：US09823593

申请日：2001-03-30

申请人： Miguel A. Saldana ,  Aleksander A. Owczarz

发明人： Miguel A. Saldana ,  Aleksander A. Owczarz

IPC分类号： B24B4916

CPC分类号： B24B37/16 ,  B24B21/08 ,  B24B49/16

摘要： An adjustable platen is provided. The adjustable platen includes a platen body having a top region and a bottom region. The platen body is oriented under a linear polishing pad of a CMP system. An air bearing is integrated with the platen body at the top region, and the air bearing is configured to apply an air pressure to an underside of the linear polishing pad. A set of bearings are connected to the bottom region of the platen body to enable controlled vertical movement of the top region of the platen body closer or further from the underside of the linear polishing pad depending on the applied air pressure. The applied air pressure is configured to exert a controllable force to the underside of the linear polishing pad. The force is controlled to meet a desired process parameters, while the carrier simply moves the wafer into position over the linear polishing pad.

公开(公告)号：US06719609B2

公开(公告)日：2004-04-13

申请号：US09842642

申请日：2001-04-27

申请人： Toshiaki Mizuno ,  Shinji Koike

发明人： Toshiaki Mizuno ,  Shinji Koike

IPC分类号： B24B4916

CPC分类号： B24B9/148 ,  B24B19/03 ,  B24B49/16

摘要： An eyeglass lens processing apparatus for processing a periphery of an eyeglass lens, includes: a lens rotating shaft which holds and rotates an eyeglass lens to be processed; an abrasive wheel rotating shaft movable between a retracted position and a processing position; a chamfering abrasive wheel which is attached to the abrasive wheel rotating shaft and which chamfers the lens while receiving a processing load from the lens during processing; a detecting unit which detects the load to the chamfering abrasive wheel; and a control unit which issues a control signal for relatively moving the lens and the chamfering abrasive wheel one from another to reduce the processing load if the detected processing load is higher than a predetermined first level and for continuing the chamfering, and which issues a control signal for ending the chamfering if the detected processing load over the entire periphery of the lens is lower than a predetermined second level.

摘要翻译： 一种用于处理眼镜镜片周边的眼镜镜片处理装置，包括：透镜旋转轴，其保持并旋转待处理的眼镜镜片; 可在缩回位置和处理位置之间移动的砂轮旋转轴; 一个倒角砂轮，其连接到砂轮旋转轴，并且在加工期间从透镜接收处理负载时倒角透镜; 检测单元，其检测对所述倒角砂轮的负荷; 以及控制单元，其发出用于相对移动透镜和倒角砂轮的控制信号，以便如果检测到的处理负载高于预定的第一水平并且用于继续倒角，则减少处理负载，并且发生控制 如果在透镜的整个周边上检测到的处理负载低于预定的第二电平，则用于结束倒角的信号。

公开(公告)号：US06623334B1

公开(公告)日：2003-09-23

申请号：US09562801

申请日：2000-05-02

申请人： Manoocher Birang ,  Shijian Li

发明人： Manoocher Birang ,  Shijian Li

IPC分类号： B24B4916

CPC分类号： B24B37/005 ,  B24B49/006 ,  B24B49/16

摘要： A chemical mechanical polishing apparatus has a polishing surface, a carrier head to press a substrate against the polishing surface with a controllable pressure, a motor to generate relative motion between the polishing surface and the carrier head at a velocity, and a controller. The controller is configured to vary at least one of the pressure and velocity in response to a signal that depends on the friction between the substrate and the polishing surface to maintain a constant torque, frictional force, or coefficient of friction.

摘要翻译： 化学机械抛光装置具有抛光面，以可控制的压力将衬底压靠抛光表面的载体头，以一定速度在抛光表面和载体头之间产生相对运动的电动机和控制器。 控制器被配置为响应于取决于基板和抛光表面之间的摩擦的信号来改变压力和速度中的至少一个，以保持恒定的扭矩，摩擦力或摩擦系数。

公开(公告)号：US06612904B1

公开(公告)日：2003-09-02

申请号：US10034268

申请日：2001-12-27

申请人： Robert G. Boehm ,  John M. Boyd

发明人： Robert G. Boehm ,  John M. Boyd

IPC分类号： B24B4916

CPC分类号： B24B37/20 ,  B24B1/005 ,  B24B49/16 ,  B24D9/08

摘要： A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.

摘要翻译： 抛光工具包括抛光垫，气囊，流体和通量引导件。 含膀胱的流体支撑抛光垫，该抛光垫邻近被抛光表面定位。 沿着膀胱的一部分定位的通量引导件将场或磁通量引导到膀胱的选定位置。 抛光表面的方法调整从引导件发出的磁场或磁通，其改变流体的机械性能。 通过调节磁通量的磁场强度或磁通量的水平，独立的压力调节发生在控制表面的抛光轮廓的气囊的选定位置处。