公开(公告)号：US06548620B2

公开(公告)日：2003-04-15

申请号：US09977415

申请日：2001-10-16

申请人： Yasuyuki Murata

发明人： Yasuyuki Murata

IPC分类号： C08G6506

CPC分类号： C08G59/145 ,  C08G59/245 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epoxy resin composition comprises an epoxy resin composition obtained by reacting 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin in the presence of an alkali metal compound. The composition has a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a glycidyl compound represented by the following structural formula (1): of 0.5% by weight or less. The curable epoxy resin composition contains the epoxy resin composition and a hardener for the epoxy resin.

摘要翻译： 本发明提供四甲基联苯型高性能环氧树脂组合物和含有环氧树脂的可固化环氧树脂组合物，可用于电气和电子领域等。 四甲基联苯型环氧树脂组合物包含在碱金属化合物的存在下使4,4'-二羟基-3,3'，5,5'-四甲基联苯与表卤代醇反应得到的环氧树脂组合物。 该组合物的四甲基联苯醌的含量为0.5重量％以下，由以下结构式（1）表示的缩水甘油基化合物的含量为0.5重量％以下。 可固化环氧树脂组合物含有环氧树脂组合物和用于环氧树脂的固化剂。