公开(公告)号：US09676228B2

公开(公告)日：2017-06-13

申请号：US14764366

申请日：2014-01-30

申请人： Van Cleef & Arpels SA

发明人： Emmanuel Piat ,  Frederic Prybilski

IPC分类号： A44C17/02 ,  B44C3/12 ,  A44C17/00

CPC分类号： B44C3/12 ,  A44C17/002 ,  A44C17/025 ,  Y10T428/24529

摘要： A decorative element including a number of stones (4) assembled in a closed frame (2) to form two decorative faces. The stones include two opposite external faces (10, 12) which are decorative, and internal faces serving as joints (20, 22) between these stones, and as edging (24, 26) with the interior contour of the frame (32). Some of these internal faces (22, 24) have grooves (28) arranged inside the volume of the frame (2) and accepting strips (34) the ends of which cross the contour of this frame at two opposing points in order to be secured. The decorative element is characterized in that the interior contour (32) of the frame (2) has a protruding cross section which fits into corresponding channels made in the internal edging faces (24, 26) of the stones (4). Applicable for example to the creation of jewelry.

公开(公告)号：US09656502B2

公开(公告)日：2017-05-23

申请号：US14643146

申请日：2015-03-10

申请人： GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY

发明人： Heung Cho Ko ,  Seok Ho Kim ,  Jongwon Yoon ,  Young Kyu Hwang ,  Su Ok Yun ,  Hun Soo Jang ,  Seong-Ju Park ,  Hyun-A Cho ,  Byeong-Il Noh ,  Jaeyi Chun

IPC分类号： B41N1/12 ,  B32B38/10 ,  B32B3/30 ,  B41C1/00 ,  G03F7/00 ,  B82Y10/00 ,  B82Y40/00

CPC分类号： B41N1/12 ,  B32B3/30 ,  B32B38/10 ,  B41C1/00 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24521 ,  Y10T428/24529

摘要： The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. The present invention allows a process of manufacturing a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process.

公开(公告)号：US09412586B2

公开(公告)日：2016-08-09

申请号：US13517970

申请日：2009-12-25

申请人： Hiroshi Amano ,  Satoshi Kamiyama ,  Myunghee Kim ,  Cyril Pernot ,  Akira Hirano

发明人： Hiroshi Amano ,  Satoshi Kamiyama ,  Myunghee Kim ,  Cyril Pernot ,  Akira Hirano

IPC分类号： C30B25/18 ,  H01L21/02 ,  C30B29/40 ,  H01L33/00

CPC分类号： C30B25/183 ,  C30B25/186 ,  C30B29/403 ,  C30B29/406 ,  H01L21/0242 ,  H01L21/0243 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/02647 ,  H01L21/0265 ,  H01L33/007 ,  Y10T428/24529

摘要： A surface of a sapphire (0001) substrate is processed to form recesses and protrusions so that protrusion tops are flat and a given plane-view pattern is provided. An initial-stage AlN layer is grown on the surface of the sapphire (0001) substrate having recesses and protrusions by performing a C+ orientation control so that a C+ oriented AlN layer is grown on flat surfaces of the protrusion tops, excluding edges, in such a thickness that the recesses are not completely filled and the openings of the recesses are not closed. An AlxGayN(0001) layer (1≧x>0, x+y=1) is epitaxially grown on the initial-stage AlN layer by a lateral overgrowth method. The recesses are covered with the AlxGayN(0001) layer laterally overgrown from above the protrusion tops. Thus, an template for epitaxial growth having a fine and flat surface and a reduced threading dislocation density is produced.

摘要翻译： 处理蓝宝石（0001）基板的表面以形成凹部和突起，使得凸起顶部是平坦的，并且提供给定的平面视图图案。 通过进行C +取向控制，在具有凹凸的蓝宝石（0001）基板的表面上生长初始阶段的AlN层，使得C +取向的AlN层生长在突出顶部的平坦表面上，不包括边缘 凹部未被完全填充且凹部的开口未被封闭的厚度。 通过横向过度生长法在初始阶段AlN层上外延生长Al x Ga y N（0001）层（1≥x> 0，x + y = 1）。 这些凹槽被从突起顶部上方横向长满的AlxGayN（0001）层覆盖。 因此，产生具有细小平坦表面和减少穿透位错密度的外延生长的模板。

公开(公告)号：US09229537B2

公开(公告)日：2016-01-05

申请号：US14255887

申请日：2014-04-17

申请人： CHICONY ELECTRONICS CO., LTD.

发明人： I-Heng Chen ,  Chung-Yao Lin ,  Yu-Hsiu Lin

IPC分类号： G06F1/16 ,  G06F3/02 ,  B32B5/24 ,  B32B9/02 ,  B32B9/04 ,  B32B7/12

CPC分类号： G06F3/0202 ,  B32B3/263 ,  B32B5/026 ,  B32B5/245 ,  B32B7/12 ,  B32B9/025 ,  B32B9/046 ,  B32B2262/0261 ,  B32B2266/0278 ,  B32B2457/00 ,  H01H2209/016 ,  Y10T156/10 ,  Y10T428/24504 ,  Y10T428/24521 ,  Y10T428/24529

摘要： A covering structure including a bottom covering layer, a top covering layer, and a thermoplastic material layer is disclosed. The thermoplastic material layer is laminated between the bottom covering layer and the top covering layer. The thermoplastic material layer includes a first thermoplastic material layer part and a second thermoplastic material layer part that are connected to each other. The first thermoplastic material layer part has a first thickness. The second thermoplastic material layer part has a second thickness. The first thickness is larger than the thickness of the top covering layer. The first thickness is 4˜7 times of the second thickness. The disclosure further discloses an input device using the covering structure and a manufacturing method of the covering structure.

摘要翻译： 公开了一种包括底部覆盖层，顶部覆盖层和热塑性材料层的覆盖结构。 热塑性材料层层压在底部覆盖层和顶部覆盖层之间。 热塑性材料层包括彼此连接的第一热塑性材料层部分和第二热塑性材料层部分。 第一热塑性材料层部分具有第一厚度。 第二热塑性材料层部分具有第二厚度。 第一厚度大于顶部覆盖层的厚度。 第一厚度是第二厚度的4〜7倍。 本发明还公开了一种使用覆盖结构的输入装置和覆盖结构的制造方法。

公开(公告)号：US20150322561A1

公开(公告)日：2015-11-12

申请号：US14647376

申请日：2012-11-30

申请人： Shiquan Cai

发明人： Shiquan Cai

IPC分类号： C23C14/00 ,  C23C14/14 ,  C23C14/12 ,  C23C14/02

CPC分类号： C23C14/0005 ,  B32B3/28 ,  B32B27/08 ,  B32B27/306 ,  B32B27/32 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/51 ,  C23C14/028 ,  C23C14/12 ,  C23C14/14 ,  C23C14/20 ,  Y10T428/24529

摘要： The present invention relates to a metal deposited film consisting of a first high polymer material layer, a metal deposited film, a second high polymer material layer and a hydrolysable high polymer material layer which are sequentially formed or attached from bottom to top; both the X axles and the Y axles of the metal deposited layer, the first high polymer material layer and the second high polymer material layer are wavy; and both the X axle and the Y axle of the lower surface of the hydrolysable high polymer material layer are wavy. Preferably, the second high polymer material layer is coated onto the metal deposited layer. The hydrolysable high polymer material layer is coated onto the second high polymer material layer. The present invention also relates to a manufacturing intermediate and a related manufacturing method for the metal deposited film, wherein a carrier film is adopted for manufacturing. The metal deposited film is smart in design and concise in structure, and its metal deposited layer can expand or stretch more uniformly, and thus has considerably high elasticity without cracks and can be transferred and attached to a stereoscopic curved surface of an object more easily; and in addition, the metal deposited layer is smart and convenient to manufacture and is applicable to large-scale popularization and application.

摘要翻译： 本发明涉及一种金属沉积膜，其由从下到上依次形成或附着的第一高分子材料层，金属沉积膜，第二高分子材料层和可水解的高分子材料层构成; 第一高分子材料层和第二高分子材料层的X轴和Y轴均为波状， 并且可水解的高分子材料层的下表面的X轴和Y轴均为波状。 优选地，将第二高分子材料层涂覆到金属沉积层上。 将可水解的高分子材料层涂覆在第二高分子材料层上。 本发明还涉及用于金属沉积膜的制造中间体和相关的制造方法，其中采用载体膜进行制造。 金属沉积膜设计巧妙，结构简洁，其金属沉积层可以更均匀地膨胀或拉伸，因此具有非常高的弹性，无裂纹，可以更容易地转移和附着到物体的立体曲面上; 此外，金属沉积层智能且方便制造，适用于大规模普及应用。

公开(公告)号：US20150204400A1

公开(公告)日：2015-07-23

申请号：US14674058

申请日：2015-03-31

申请人： R.A. Investment Management S.A.R.L.

发明人： Ray ARBESMAN ,  Nghi PHAM ,  Winston MACKELVIE

IPC分类号： F16D65/00 ,  B32B15/18 ,  B32B9/00 ,  B32B9/04 ,  B32B3/30 ,  B32B7/08

CPC分类号： B32B9/007 ,  B32B3/266 ,  B32B3/30 ,  B32B7/08 ,  B32B9/041 ,  B32B15/18 ,  B32B2307/102 ,  B32B2307/536 ,  B32B2307/54 ,  B32B2307/56 ,  B32B2475/00 ,  B32B2605/00 ,  F16D65/0006 ,  F16D65/0971 ,  F16D2200/0021 ,  F16D2200/0034 ,  F16D2200/0052 ,  F16J15/122 ,  Y10T428/24289 ,  Y10T428/24339 ,  Y10T428/24529 ,  Y10T428/24545

摘要： The present invention is a laminate sheet having two laminae. The first lamina is a relatively hard material having first and second surfaces. The first surface has a plurality of raised and generally pointed piercing structures, each structure having a tip. The second lamina is graphite foil material, which is mated to the relatively hard material, such that at least some of the piercing structures pierce the graphite foil material. In one embodiment, the first lamina has no perforations and is uniformly smooth. In another embodiment, the second surface also has a plurality of piercing structures and a third lamina comprising graphite foil is mated to the second surface.

摘要翻译： 本发明是具有两层的层叠片。 第一层是具有第一表面和第二表面的相对硬的材料。 第一表面具有多个凸起和大致尖锐的穿孔结构，每个结构具有尖端。 第二层是石墨箔材料，其与相对硬的材料配合，使得至少一些穿孔结构刺穿石墨箔材料。 在一个实施例中，第一层没有穿孔并且是均匀光滑的。 在另一个实施例中，第二表面还具有多个穿孔结构，并且包括石墨箔的第三层与第二表面配合。

公开(公告)号：US20150159511A1

公开(公告)日：2015-06-11

申请号：US14620633

申请日：2015-02-12

申请人： Mikro Systems, Inc.

发明人： Andrew J. Burns ,  Gary B. Merrill ,  John R. Paulus

IPC分类号： F01D25/00 ,  C04B35/622 ,  B22F7/02

CPC分类号： F01D25/007 ,  B22F3/22 ,  B22F5/04 ,  B22F7/02 ,  B22F7/06 ,  B22F2005/005 ,  C04B35/62222 ,  C23C24/08 ,  F01D25/005 ,  Y10T428/12472 ,  Y10T428/239 ,  Y10T428/24355 ,  Y10T428/24529 ,  Y10T428/24545

摘要： A method of manufacturing a substrate (16) with a ceramic thermal barrier coating (28, 32). The interface between layers of the coating contains an engineered surface roughness (12, 24) to enhance the mechanical integrity of the bond there between. The surface roughness is formed in a surface of a mold (10,20) and is infused by a subsequently cast layer of material (16, 28). The substrate may be partially sintered (76) prior to application of the coating layer(s) and the coated substrate and coating layer(s) may be co-sintered to form a fully coherent strain-free interlayer.

摘要翻译： 一种用陶瓷热障涂层（28,32）制造衬底（16）的方法。 涂层之间的界面包含工程表面粗糙度（12,24），以增强其间的结合的机械完整性。 表面粗糙度形成在模具（10,20）的表面中，并且被随后浇铸的材料层（16,28）输注。 在施加涂层之前，基材可以部分烧结（76），并且涂覆的基材和涂层可以被共烧结以形成完全相干的无应变中间层。

公开(公告)号：US20150099096A1

公开(公告)日：2015-04-09

申请号：US14045483

申请日：2013-10-03

申请人： The Boeing Company

发明人： Gabriel Z. Forston ,  Christopher G. Harris ,  Joshua P. Tyndall ,  Hyukbong Kwon ,  Carolyn Schmidt

IPC分类号： B32B7/00 ,  B32B37/26

CPC分类号： B32B27/20 ,  B29C66/4344 ,  B29C66/43441 ,  B29C66/496 ,  B29C66/524 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/73115 ,  B29C66/73117 ,  B29C66/73756 ,  B29C66/73941 ,  B29C66/91411 ,  B29C66/91935 ,  B29C70/086 ,  B29C70/86 ,  B29L2031/3076 ,  B29L2031/3082 ,  B29L2031/3085 ,  B32B7/06 ,  B32B27/08 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2605/18 ,  B64C1/064 ,  B64C1/12 ,  B64C2001/0072 ,  Y02T50/43 ,  Y10T428/24529 ,  Y10T428/249952 ,  B29K2307/04 ,  B29K2309/08

摘要： An apparatus includes a first thermoset layer that includes a first fibrous material embedded in a first thermoset matrix. The apparatus also includes a second thermoset layer that includes a second fibrous material embedded in a second thermoset matrix. The second thermoset layer is coupled to the first thermoset layer to form a joint. Further, a gap is defined between the first thermoset layer and the second thermoset layer. The apparatus also includes a thermoplastic filler that is made from a thermoplastic material. The thermoplastic filler is positioned within the gap.

摘要翻译： 一种装置包括第一热固性层，其包括嵌入第一热固性基质中的第一纤维材料。 该装置还包括第二热固性层，其包括嵌入第二热固性基质中的第二纤维材料。 第二热固性层耦合到第一热固性层以形成接头。 此外，在第一热固性层和第二热固性层之间限定间隙。 该设备还包括由热塑性材料制成的热塑性填料。 热塑性填料位于间隙内。

公开(公告)号：US20130270224A1

公开(公告)日：2013-10-17

申请号：US13912591

申请日：2013-06-07

申请人： International Business Machines Corporation

发明人： Lawrence A. Clevenger ,  Timothy J. Dalton ,  Elbert E. Huang ,  Sampath Purushothaman ,  Carl J. Radens

IPC分类号： H05K3/40

CPC分类号： H05K3/40 ,  H01B17/66 ,  H01L21/0337 ,  H01L21/31144 ,  H01L21/76822 ,  H01L23/53295 ,  H01L2924/0002 ,  Y10T156/1039 ,  Y10T156/1082 ,  Y10T428/24521 ,  Y10T428/24529 ,  Y10T428/24537 ,  Y10T428/24612 ,  Y10T428/24711 ,  H01L2924/00

摘要： Dielectric composite structures comprising interfaces possessing nanometer scale corrugated interfaces in interconnect stack provide enhances adhesion strength and interfacial fracture toughness. Composite structures further comprising corrugated adhesion promoter layers to further increase intrinsic interfacial adhesion are also described. Methods to form the nanometer scale corrugated interfaces for enabling these structures using self assembling polymer systems and pattern transfer process are also described.

公开(公告)号：US08512849B2

公开(公告)日：2013-08-20

申请号：US11836253

申请日：2007-08-09

申请人： Lawrence A. Clevenger ,  Timothy J. Dalton ,  Elbert E. Huang ,  Sampath Purushothaman ,  Carl J. Radens

发明人： Lawrence A. Clevenger ,  Timothy J. Dalton ,  Elbert E. Huang ,  Sampath Purushothaman ,  Carl J. Radens

IPC分类号： B32B3/30

CPC分类号： H05K3/40 ,  H01B17/66 ,  H01L21/0337 ,  H01L21/31144 ,  H01L21/76822 ,  H01L23/53295 ,  H01L2924/0002 ,  Y10T156/1039 ,  Y10T156/1082 ,  Y10T428/24521 ,  Y10T428/24529 ,  Y10T428/24537 ,  Y10T428/24612 ,  Y10T428/24711 ,  H01L2924/00

摘要： Dielectric composite structures comprising interfaces possessing nanometer scale corrugated interfaces in interconnect stack provide enhances adhesion strength and interfacial fracture toughness. Composite structures further comprising corrugated adhesion promoter layers to further increase intrinsic interfacial adhesion are also described. Methods to form the nanometer scale corrugated interfaces for enabling these structures using self assembling polymer systems and pattern transfer process are also described.