Solid phase change refrigeration
    2.
    发明授权
    Solid phase change refrigeration 失效
    固相变冷

    公开(公告)号:US06367281B1

    公开(公告)日:2002-04-09

    申请号:US09866206

    申请日:2001-05-24

    IPC分类号: F25B2300

    CPC分类号: F25B23/00 F24V99/00

    摘要: A refrigeration cycle is disclosed whereby: straining a material results in a solid phase change of the material. This phase change is accompanied by an adiabatic and nearly reversible temperature rise in the material. The material in its strained state rejects heat to its surroundings. When said material is relaxed from its strained state, a solid phase change occurs back to its initial phase. This phase change is accompanied by an adiabatic and nearly reversible temperature drop, in the material. In the relaxed state said material absorbs heat from a low temperature source.

    摘要翻译: 公开了一种制冷循环,其中:使材料变形导致材料的固相变化。 该相变伴随着材料中的绝热和几乎可逆的温度升高。 处于紧张状态的材料将热量排除在周围。 当所述材料从其应变状态放松时,固相变化发生回到其初始阶段。 该相变伴随材料中的绝热和几乎可逆的温度下降。 在松弛状态下,材料吸收低温源的热量。

    Cooling system with auxiliary thermal buffer unit for cooling an electronics module
    3.
    发明授权
    Cooling system with auxiliary thermal buffer unit for cooling an electronics module 失效
    具有辅助热缓冲单元的冷却系统用于冷却电子模块

    公开(公告)号:US06397618B1

    公开(公告)日:2002-06-04

    申请号:US09867855

    申请日:2001-05-30

    IPC分类号: F25B2300

    摘要: A cooling system and method of fabrication are provided for cooling an electronics device. The cooling system includes a cooling unit and an evaporator plate having at least one isolated refrigerant loop therein for receiving coolant from the cooling unit. A thermal buffer unit having a phase change material therein is thermally coupled to the evaporator plate to maintain temperature of the evaporator plate within a predefined range for a period of time upon failure or shut down of the cooling unit. A thermal conductor structure, such as a metal foam structure and/or thermal transfer rods, is disposed within the thermal buffer unit to facilitate heat transfer between the phase change material and the evaporator plate.

    摘要翻译: 提供冷却系统和制造方法来冷却电子设备。 冷却系统包括冷却单元和蒸发器板,其中具有至少一个隔离的制冷剂回路,用于从冷却单元接收冷却剂。 其中具有相变材料的热缓冲单元热耦合到蒸发器板,以在冷却单元故障或关闭时将蒸发器板的温度保持在预定范围内一段时间。 诸如金属泡沫结构和/或热转移棒的热导体结构设置在热缓冲单元内,以促进相变材料和蒸发器板之间的热传递。