公开(公告)号：US5334872A

公开(公告)日：1994-08-02

申请号：US62567

申请日：1993-05-18

申请人： Tetsuya Ueda ,  Osamu Nakagawa

发明人： Tetsuya Ueda ,  Osamu Nakagawa

IPC分类号： H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H01L23/48 ,  H01L23/02 ,  H01L23/28 ,  H01L27/54

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/181

摘要： A packaged semiconductor device includes a semiconductor chip having first and second surfaces, a plurality of electrodes formed on the first surface of the semiconductor chip, a die pad bonded to the second surface of the semiconductor chip for supporting the semiconductor chip, a plurality of leads having first and second ends, the first ends being connected to corresponding electrodes of the semiconductor chip, a heat spreading plate disposed in opposed relation to the die pad and having an area larger than that of the die pad, at least one end portion of the heat spreading plate lying in the same plane as the second ends of the plurality of leads, and a resin package body encapsulating the semiconductor chip, the die pad, the first ends of the plurality of leads, and the heat spreading plate.

摘要翻译： 封装半导体器件包括具有第一和第二表面的半导体芯片，形成在半导体芯片的第一表面上的多个电极，连接到用于支撑半导体芯片的半导体芯片的第二表面的芯片焊盘，多个引线 具有第一端和第二端，所述第一端连接到所述半导体芯片的对应电极，与所述芯片焊盘相对设置并且具有大于所述管芯焊盘的面积的散热板，所述散热板的至少一个端部 与多根引线的第二端部位于同一平面上的散热板以及封装半导体芯片，芯片焊盘，多个引线的第一端部和散热板的树脂封装主体。