Method to fabricate a high coupling flash cell with less silicide seam problem
    1.
    发明授权
    Method to fabricate a high coupling flash cell with less silicide seam problem 有权
    制造具有较少硅化物接缝问题的高耦合闪存单元的方法

    公开(公告)号:US06232635B1

    公开(公告)日:2001-05-15

    申请号:US09543991

    申请日:2000-04-06

    IPC分类号: H01L291788

    CPC分类号: H01L27/11521 H01L27/115

    摘要: An article and method of manufacturing a semiconductor flash cell. The method includes producing an isolation formation layer on a silicon substrate, forming an oxide on the isolation formation layer, growing a tunnel oxide layer thereon, depositing a first poly silicon layer, masking and etching the first poly silicon layer, depositing a second poly silicon layer and performing a blanket etch back step, forming an oxide/nitride/oxide layer forming a third poly-silicon layer and depositing a silicide layer thereon.

    摘要翻译: 制造半导体闪存单元的制品和方法。 该方法包括在硅衬底上制造隔离层,在隔离层上形成氧化物,在其上生长隧道氧化物层,沉积第一多晶硅层,掩蔽和蚀刻第一多晶硅层,沉积第二多晶硅 层并进行覆盖层回蚀步骤,形成形成第三多晶硅层的氧化物/氮化物/氧化物层并在其上沉积硅化物层。