公开(公告)号：US20040160144A1

公开(公告)日：2004-08-19

申请号：US10367106

申请日：2003-02-14

发明人： Christopher M. W. Daft ,  Paul A. Wagner ,  Igal Ladabaum

IPC分类号： H04R019/00 ,  H02N002/00

CPC分类号： G01S15/8925 ,  B06B1/0292 ,  G01S7/52046 ,  G10K11/341

摘要： A capacitive microfabricated ultrasonic transducer with control of elevation phase through alternating bias polarity is disclosed. Such control of elevation phase results in simple ultrasonic probes with excellent slice thickness attributes. Furthermore, tight spatial variation of phase results in an effective way to achieve transmit aperture and apodization control. Further still, such capacitive microfabricated ultrasonic transducers can achieve elevation focus without the need of a lossy mechanical lens.

摘要翻译： 公开了一种通过交替偏置极性控制高程相的电容式微制造超声换能器。 这种升高相位的控制导致具有优异切片厚度属性的简单超声波探头。 此外，相位的紧密空间变化导致实现传输孔径和变迹控制的有效方式。 此外，这种电容微型超声波换能器可以实现仰角，而不需要有损耗的机械透镜。

公开(公告)号：US20040141421A1

公开(公告)日：2004-07-22

申请号：US10349597

申请日：2003-01-22

发明人： Ching-Hsiang Cheng ,  Arif S. Ergun ,  Butrus T. Khuri-Yakub

IPC分类号： H04R019/00

CPC分类号： H01L21/76898 ,  B06B1/0292 ,  B06B1/06 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00

摘要： A wafer with through wafer interconnects. The wafer includes spaced through wafer vias which extend between the back side and front side of the wafer. A conductor within each of said vias connects to front and back side pads. Functions associated with said conductor and said pads provide a depletion region in the wafer between the pads and wafer or pads and conductor and the wafer.

摘要翻译： 具有贯通晶片互连的晶片。 晶片包括在晶片的背侧和前侧之间延伸的间隔开的晶片通孔。 每个所述通孔内的导体连接到前侧和后侧衬垫。 与所述导体和所述焊盘相关联的功能在焊盘和晶片或焊盘与导体和晶片之间的晶片中提供耗尽区。

公开(公告)号：US20030048698A1

公开(公告)日：2003-03-13

申请号：US09949420

申请日：2001-09-07

申请人： Siemens Medical Systems, Inc.

发明人： Stephen R. Barnes ,  Robert N. Phelps ,  Mirsaid Seyed Bolorforosh

IPC分类号： H04R019/00

CPC分类号： H04R23/00 ,  B06B1/0215 ,  B06B1/0292 ,  B06B2201/51 ,  B06B2201/76 ,  G01S7/52033 ,  G01S7/52038 ,  G01S7/52039 ,  G01S15/8915 ,  G01S15/895 ,  H04R2201/021

摘要： A method and system for controlling bias voltage for use with an electrostatic transducer are provided. The bias voltage is dynamically varied or set as a function of imaging mode, depth gain compensation, elevational apodization, azimuthal apodization, timing with respect to the transmit waveform, center frequency of transmit and receive waves and desired modulation. Opposite polarity on sub-elements is also provided for removing signals from electromagnetic interference and crosstalk between elements.

摘要翻译： 提供了一种用于控制与静电换能器一起使用的偏置电压的方法和系统。 偏置电压根据成像模式，深度增益补偿，高程变迹，方位角变迹，发射波形的定时，发射和接收波的中心频率以及期望的调制而动态变化或设置。 还提供了子元件上的相反极性，用于从电磁干扰和元件之间的串扰中去除信号。

公开(公告)号：US20020048220A1

公开(公告)日：2002-04-25

申请号：US09728713

申请日：2000-11-30

发明人： Butrus T. Khuri-Yakub ,  Abdullah Atalar ,  Arif S. Ergun ,  F. Levent Degertekin

IPC分类号： H04R019/00

CPC分类号： B06B1/0292 ,  G01H11/06 ,  G01S3/808 ,  G01S7/003 ,  H04R1/44 ,  H04R3/06 ,  H04R19/04

摘要： A wide frequency band micromachined microphone including a plurality of micromachined cells of the type including electrodes carried by a membrane supported above a common electrode with conductive lines interconnecting the electrodes is described. A method of operating a microphone array is also described.

公开(公告)号：US20040085858A1

公开(公告)日：2004-05-06

申请号：US10638057

申请日：2003-08-07

发明人： Butrus T. Khuri-Yakub ,  Yongli Huang ,  Arif S. Ergun

IPC分类号： H04R019/00

CPC分类号： B81C1/00158 ,  B06B1/0292 ,  B06B1/0688 ,  B81B2201/0257 ,  B81C2203/036 ,  G01H11/08

摘要： There is described a micromachined ultrasonic transducers (MUTS) and a method of fabrication. The membranes of the transducers are fusion bonded to cavities to form cells. The membranes are formed on a wafer of sacrificial material. This permits handling for fusions bonding. The sacrificial material is then removed to leave the membrane. Membranes of silicon, silicon nitride, etc. can be formed on the sacrificial material. Also described are cMUTs, pMUTs and mMUTs.

摘要翻译： 描述了微机械超声换能器（MUTS）和制造方法。 换能器的膜融合到空腔中以形成细胞。 膜形成在牺牲材料的晶片上。 这样可以处理熔接。 然后去除牺牲材料以离开膜。 可以在牺牲材料上形成硅，氮化硅等膜。 还描述了cMUT，pMUT和mMUT。

公开(公告)号：US20020067663A1

公开(公告)日：2002-06-06

申请号：US09935754

申请日：2001-08-23

发明人： Peter V. Loeppert ,  Michael Pedersen

IPC分类号： H04R019/00

CPC分类号： B81B3/0072 ,  B81B2201/0264 ,  B81B2203/0127 ,  H04R19/005 ,  H04R31/00 ,  H04R31/006

摘要： An acoustic transducer is disclosed including: a fixed perforated member; a freely movable diaphragm spaced from the perforated member; a support ring in the perforated member maintaining the proper spacing between the diaphragm and the perforated member near the perimeter; means of suspension allowing the diaphragm to rest freely on the support ring and yet mechanically decouples the diaphragm from the perforated member; means of applying an electrical field in the space between the perforated member and the diaphragm; means of detecting the change of electrical capacitance between the perforated member and the diaphragm when the diaphragm moves in response to an incident acoustic sound pressure wave.

摘要翻译： 公开了一种声换能器，包括：固定的有孔构件; 与穿孔构件隔开的可自由移动的隔膜; 多孔构件中的支撑环保持隔膜和穿孔构件之间在周边附近的适当间隔; 悬挂装置，允许隔膜在支撑环上自由地安置，并且使膜片与多孔构件机械地分离; 在多孔构件和隔膜之间的空间中施加电场的装置; 当隔膜响应入射的声压波而移动时，检测穿孔构件和隔膜之间的电容变化的装置。