公开(公告)号：US20230080787A1

公开(公告)日：2023-03-16

申请号：US17903168

申请日：2022-09-06

申请人： Neturen Co., Ltd.

发明人： Takuya SUZUKI ,  Masahiro Tsukahara ,  Osamu Idohara ,  Setsuo Takaki

IPC分类号： B23K20/02

摘要： A steel joined body includes a plurality of steels joined together, the plurality of steels including a joint interface having a carbon concentration of 0.20 mass % or more and 2.10 mass % or less, and the steel joined body including a concentration gradient layer having a carbon concentration decreasing with distance from the joint interface.

公开(公告)号：US20230007988A1

公开(公告)日：2023-01-12

申请号：US17950319

申请日：2022-09-22

申请人： TOYAMA PREFECTURE

发明人： Hideki YAMAGISHI

IPC分类号： B23K20/02 ,  B23K20/227

摘要： The method comprises applying a spot load to a joint part between a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other. When a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T0 mm, the total thickness thereof after bonding is defined as T1 mm, and T0/T1=R is defined as a reduction ratio, the reduction ratio R is 1.4 or more.

公开(公告)号：US11524359B2

公开(公告)日：2022-12-13

申请号：US16639859

申请日：2018-08-23

申请人： Georgia Tech Research Corporation

发明人： Waylon Puckett ,  Darshan G. Pahinkar ,  Samuel Graham

IPC分类号： B23K1/00 ,  B23K20/02 ,  H01L21/48 ,  H01L23/373 ,  B23K103/00 ,  B23K101/40

摘要： Disclosed herein are power electronic modules formed by directly bonding a heat sink to a dielectric substrate using transition liquid phase bonding.

公开(公告)号：US20220388092A1

公开(公告)日：2022-12-08

申请号：US17829752

申请日：2022-06-01

申请人： National Taiwan University

发明人： Tung-Han CHUANG ,  Po-Ching WU ,  Pei-Ing LEE ,  Yu-Chang LAI ,  Hsing-Hua TSAI ,  Chung-Hsin CHOU

IPC分类号： B23K20/233 ,  B23K20/02 ,  B23K20/16

摘要： A method for forming a bonding structure is provided, including providing a first metal, wherein the first metal has a first absolute melting point. The method includes forming a silver nano-twinned layer on the first metal. The silver nano-twinned layer includes parallel-arranged twin boundaries. The parallel-arranged twin boundaries include 90% or more [111] crystal orientation. The method includes oppositely bonding the silver nano-twinned layer to a second metal. The second metal has a second absolute melting point. The bonding of the silver nano-twinned layer and the second metal is performed at a temperature of 300° C. to half of the first absolute melting point or 300° C. to half of the second absolute melting point.

公开(公告)号：US20220355372A1

公开(公告)日：2022-11-10

申请号：US17619737

申请日：2020-06-12

申请人： Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)

发明人： Yoshihaya IMAMURA ,  Chieko IMAI ,  Toshiaki KITAZAWA ,  Hisaomi MASUZAWA

IPC分类号： B22D19/04 ,  B23K20/02 ,  B22D27/09

摘要： A method for joining an aluminum material includes, in the following order, arranging a first wrought aluminum alloy material along a first jig in an internal space defined between the first jig and a second jig that is arranged to face the first jig and has a pouring port, pouring molten aluminum toward the first wrought aluminum alloy material through the pouring port under pressure to cause the molten aluminum to collide with a surface of the first wrought aluminum alloy material, thereby digging down the first wrought aluminum alloy material at a collision position between the molten aluminum and the first wrought aluminum alloy material, and flowing the molten aluminum together with a fraction of the first wrought aluminum alloy material removed by digging within the internal space along a surface of the first wrought aluminum alloy material around the collision position.

公开(公告)号：US11484755B2

公开(公告)日：2022-11-01

申请号：US16950698

申请日：2020-11-17

申请人： KARSTEN MANUFACTURING CORPORATION

发明人： Eric J. Morales ,  Erik M. Henrikson

IPC分类号： A63B53/04 ,  A63B53/08 ,  A63B60/00 ,  B23K20/02 ,  B23K20/233 ,  B23K103/14

摘要： Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein.

公开(公告)号：US20220339733A1

公开(公告)日：2022-10-27

申请号：US17859317

申请日：2022-07-07

申请人： Paul Po CHENG

发明人： Paul Po CHENG

IPC分类号： B23K20/02 ,  F16L13/02

摘要： A system for securing first and second metal workpieces to a central metal workpiece located therebetween. The system includes clamps to secure the first and second metal workpieces in coaxial alignment with the central metal workpiece, which is rotatable about its axis. Heating elements heat opposed ends of the first metal workpiece and the central metal workpiece, and opposed ends of the second metal workpiece and the central metal workpiece, to a hot working temperature. While the opposed ends are at the hot working temperature, the heating elements are removed. The opposed end of the first metal workpiece is urged against the end opposed thereto of the rotating central metal workpiece, while the central metal workpiece rotates. At the same time, the rotating central metal workpiece is pulled against the second metal workpiece to engage the opposed ends thereof with each other. The workpieces are then allowed to cool.

公开(公告)号：US11456273B2

公开(公告)日：2022-09-27

申请号：US16682840

申请日：2019-11-13

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jaecheol Kim ,  Gilman Kang ,  Yongdae Ha

IPC分类号： B23K20/00 ,  H01L23/00 ,  B23K20/02 ,  B23K101/40

摘要： A bonding head for performing a thermal compression process including a base body. A bonding heater is disposed on the base body that generates a melting heat. A bonding tool is disposed on the bonding heater that compresses a bonding object against a bonding base while transferring the melting heat to the bonding object to thereby bond the bonding object to the bonding base by the thermal compression process. A heat controller is disposed at the bonding tool, and a thermal conductivity of the heat controller is less than a thermal conductivity of the bonding tool.

公开(公告)号：US11376627B2

公开(公告)日：2022-07-05

申请号：US15781148

申请日：2016-11-22

申请人： SHINKAWA LTD.

发明人： Hikaru Miura ,  Takuya Asami ,  Yasumoto Togashi ,  Nobuyuki Aoyagi

IPC分类号： B23K20/02 ,  B06B1/02 ,  B23K20/10 ,  B06B3/00 ,  B23K20/00

摘要： An ultrasonic horn is provided with: a vibration generating unit configured to generate longitudinal vibration having a frequency in the ultrasonic band on the basis of a signal having a frequency in the ultrasonic band input from an oscillator; a vibration amplifying unit configured to amplify the vibration generating unit while transmitting the longitudinal vibration from the vibration generating unit; and a longitudinal-torsional vibration conversion slit unit having slits formed in a groove-like shape on the surfaces of the vibration amplifying unit and configured to convert the longitudinal vibration into torsional vibration. The vibration amplifying unit has a polygonal shape in a plane view, and has a plurality of surfaces provided with slits along with a surface not provided with slits.

公开(公告)号：US11362058B2

公开(公告)日：2022-06-14

申请号：US16233408

申请日：2018-12-27

申请人： NEXPERIA B.V.

发明人： Ralph Huybers ,  Hans Van De Rijdt

IPC分类号： G11C16/04 ,  H01L23/00 ,  H01L21/683 ,  B23K20/02 ,  H01L21/68

摘要： A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.