公开(公告)号：US12230431B2

公开(公告)日：2025-02-18

申请号：US17167622

申请日：2021-02-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： No Il Park ,  Seung Mo Lim ,  Tae Jun Choi ,  Boum Seock Kim ,  Byung Soo Kang

IPC: H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12 ,  H01F27/29

Abstract: A coil component includes a body having a first surface and a first end surface and a second end surface each connected to the first surface and opposing each other, a support substrate disposed in the body, a coil unit including a first coil pattern, a first lead pattern and a second lead pattern respectively disposed on a first surface of the support substrate opposing the first surface of the body, first and second slit portions respectively disposed in edge portions between the first end surface and the second end surface of the body and exposing the first and second lead patterns, and first and second external electrodes arranged in the first and second slit portions and connected to the coil unit, wherein a ratio of a line width of any one of the first and second lead patterns to a line width of any one turn of the first coil pattern satisfies 1 to 1.5.

公开(公告)号：US12224102B2

公开(公告)日：2025-02-11

申请号：US17224572

申请日：2021-04-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han Kyeol Kim ,  Myoung Soon Park ,  Sung Hee Kim ,  Ji Young Park

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/255 ,  H01F27/29 ,  H01F41/04

Abstract: A coil component includes: a body; a support substrate disposed in the body; a coil portion including coil patterns, lead patterns, and extension patterns, while disposed on the support substrate, the lead patterns being exposed to the body, and the extension patterns connecting the coil patterns and the lead patterns; and external electrodes disposed on the body and contacting the lead patterns, wherein the lead pattern has an inner portion adjacent to the extension pattern, an outer portion adjacent to the external electrode, and a middle portion disposed between the inner portion and the outer portion, and a width of the middle portion is larger than a width of the inner portion and smaller than a width of the outer portion.

公开(公告)号：US12224100B2

公开(公告)日：2025-02-11

申请号：US16879013

申请日：2020-05-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hun Kim ,  Byeong Cheol Moon ,  Joung Gul Ryu

IPC: H01F27/28 ,  H01F17/00 ,  H01F17/04 ,  H01F27/30 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: A coil component includes a support substrate having one surface including at least one groove portion; a coil portion disposed to contact the one surface of the support substrate; and a body embedding the support substrate and the coil portion, wherein the coil portion has an anchor portion disposed in the at least one groove portion, and a pattern portion disposed on the anchor portion and spaced apart from the one surface of the support substrate. A line width of the anchor portion is narrower than a line width of the pattern portion.

公开(公告)号：US12217905B2

公开(公告)日：2025-02-04

申请号：US17977038

申请日：2022-10-31

Applicant: TDK CORPORATION

Inventor： Hidenobu Umeda ,  Masaki Takahashi ,  Kaori Sasaki ,  Nami Enomoto

IPC: H01F27/32 ,  H01F27/28 ,  H01F41/04 ,  H01F41/12

Abstract: An electronic component includes a glass ceramic layer and a conductor layer. The glass ceramic layer includes feldspar crystal phases, non-crystalline glass phases, and Al2O3 phases. The area ratio of the feldspar crystal phases in the vicinity of the conductor layer is larger than the area ratio of the feldspar crystal phases away from the conductor layer.

公开(公告)号：US12217897B2

公开(公告)日：2025-02-04

申请号：US17368332

申请日：2021-07-06

Applicant: TDK CORPORATION

Inventor： Yuya Oshima ,  Junichi Otsuka ,  Shinichi Kondo ,  Yohei Tadaki ,  Kazuo Iwai ,  Masayuki Suzuki ,  Emiri Matsuhashi ,  Takuya Niibori

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04

Abstract: A multilayer coil component includes an element body, first and second coils, and a pair of external electrodes. The element body includes a plurality of insulator layers laminated in a first direction. The element body has a pair of end surfaces opposing each other in a second direction orthogonal to the first direction. The first coil and the second coil are disposed in the element body and respectively have coil shafts along the second direction. The pair of external electrodes are disposed on the pair of end surfaces and electrically connected to both ends of the first coil and the second coil. The first coil includes a first conductor layer, a second conductor layer, and a first through hole conductor. The coil shaft of the first coil is disposed inside the second coil.

公开(公告)号：US12217896B2

公开(公告)日：2025-02-04

申请号：US17116091

申请日：2020-12-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Yoon ,  Dong Hwan Lee ,  Dong Jin Lee ,  Sang Soo Park

IPC: H01F27/29 ,  H01F27/255 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: A coil component includes a body, a planar spiral-shaped coil portion disposed in the body, a lead portion disposed to be spaced apart from the coil portion in the body, a support substrate disposed between the coil portion and the lead portion to correspond to the lead portion, a via penetrating through the support substrate to connect an internal end portion of the coil portion and an internal end portion of the lead portion to each other, an insulating layer covering the coil portion and the lead portion, and a first external electrode and a second external electrode disposed to be spaced apart from each other on a surface of the body and connected to the external end portion of each of the coil portion and the lead portion.

公开(公告)号：US12205750B2

公开(公告)日：2025-01-21

申请号：US17538131

申请日：2021-11-30

Applicant: Dialog Semiconductor (UK) Limited

Inventor： Shih-Wen Tang ,  Jesus Mennen Belonio, Jr. ,  Che-Han Li

IPC: H01L23/31 ,  H01F27/02 ,  H01F27/28 ,  H01F41/04 ,  H01L49/02

Abstract: An inductor package is described comprising a mold interconnection substrate having an embedded spiral coil inductor, a fan-out redistribution layer connected to the spiral coil inductor by a copper post wiring structure, a ferrite toroid coil in between the copper posts, and a semiconductor die mounted on the mold interconnection substrate and connected to the fan-out redistribution layer.

公开(公告)号：US20250022654A1

公开(公告)日：2025-01-16

申请号：US18349266

申请日：2023-07-10

Applicant: Allegro MicroSystems, LLC

Inventor： Vijay Mangtani ,  William P. Taylor

IPC: H01F41/04 ,  H01F17/00 ,  H01F41/02

Abstract: Aspects of the present disclosure include systems, structures, circuits, and methods providing pin-coupled transformers and/or pin-coupled coil structures. A pin-coupled coil structure can include first and second substrates, each having a plurality of conductive traces. The conductive traces of the substrates are connected by conductive pins, forming one or more pin-coupled coil structures. Two pin-coupled coils structure can be configured around a transformer core forming a pin-coupled transformer structure. The pin-coupled transformer structure can be included in integrated circuit (chip) packages or modules. The packages and modules may include various types of circuits; in some examples, chip packages or modules may include a galvanically isolated gate driver or other high voltage circuit.

公开(公告)号：US20250022642A1

公开(公告)日：2025-01-16

申请号：US18708853

申请日：2022-11-10

Applicant: Tokamak Energy Ltd

Inventor： Jeroen Van Nugteren ,  Matthew Bristow

IPC: H01F6/06 ,  H01F41/04 ,  H01F41/074

Abstract: A high temperature superconducting. HTS, field coil. The HITS field coil comprises a plurality of HITS tapes (510) arranged to form turns of the HITS field coil, and a substrate (500) separating each of the turns. The turns form a coiled path around an inner perimeter of the field coil, wherein distance from the inner perimeter of the field coil increases monotonically with movement in a first direction along the coiled path. For each HITS tape except the radially innermost HITS tape, each end of the HITS tape is offset in the first direction from the corresponding end of an adjacent HITS tape which is radially inward of the said HITS tape, and the HITS tape overlaps the adjacent HITS tape over at least 50% of the length of the adjacent HTS tape. Each HITS tape has a length less than a perimeter of the coil plus the magnitude of the offset between one end of the HITS tape and the corresponding end of the adjacent HITS tape which is radially outward of the HITS tape.

公开(公告)号：US20250014803A1

公开(公告)日：2025-01-09

申请号：US18741034

申请日：2024-06-12

Applicant: Alps Alpine Co., Ltd.

Inventor： Satoshi MARUYAMA ,  Takeshi TAKAHASHI ,  Kosuke CHIMATA ,  Shuji IGUCHI ,  Setsuko MARUYAMA

IPC: H01F27/28 ,  H01F27/255 ,  H01F27/29 ,  H01F41/04

Abstract: A coil component includes a coil portion and a main body. The coil portion has a central axis along a first direction and a ring-shaped conductor with two electric ends. The main body includes magnetic powder and a binder, and covers the ring-shaped conductor with a first surface and a second surface arranged side by side in the first direction. The main body has a first region formed of a first material and a second region formed of a second material. The first region includes the first surface and a central region, where the entire outer edge of the central region is in contact with the inner circumferential surface of the ring-shaped conductor, while the second region includes at least part of the second surface. The first material is different from the second material in at least one property in the magnetic powder, the binder, and another component, if any.