公开(公告)号：US11615911B2

公开(公告)日：2023-03-28

申请号：US16879020

申请日：2020-05-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Hyuk Jung ,  Sung Hee Kim ,  Young Sun Kim

IPC: H01F27/29 ,  H01F27/24

Abstract: A coil component includes a body, a support substrate embedded in the body, a first coil portion and a second coil portion disposed on the support substrate, a first external electrode and a second external electrode disposed on one end surface of the body to be spaced apart from each other, a third external electrode and a fourth external electrode disposed on the other end surface of the body to be spaced apart from each other, a surface insulating layer disposed on one surface of the body connecting the one end surface and the other end surface of the body to each other, and an edge protection layer disposed between the first and second external electrodes and between the third and fourth external electrodes in the one end surface and the other end surface of the body, and having one end portion extending upwardly of the surface insulating layer.

公开(公告)号：US20210225578A1

公开(公告)日：2021-07-22

申请号：US16884242

申请日：2020-05-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Hyuk Jung ,  Young Sun Kim ,  Sung Hee Kim

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/255 ,  H01F17/04 ,  H01F17/00

Abstract: A coil component includes a support substrate, a first coil and a second coil disposed on the support substrate to be spaced apart from each other, and a body including a first core and a second core penetrating through the first coil portion and the second coil portion and spaced apart from each other. The first coil portion has a first winding portion, forming at least one turn about the first core, and a first extension portion extending from one end portion of the first winding portion to surround the first core and the second core. The second coil has a second winding portion, forming at least one turn about the second core, and a second extension portion extending from one end portion of the second winding portion to surround the first core and the second core. A separation distance between a given turn of the first coil portion and an adjacent turn of the second coil portion is different from a separation distance between adjacent turns of the first coil portion.

公开(公告)号：US20210134509A1

公开(公告)日：2021-05-06

申请号：US15931161

申请日：2020-05-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Il Park ,  In Suk Kim ,  Young Sun Kim ,  Sung Hee Kim ,  In Young Kang

IPC: H01F27/08 ,  H01F27/29 ,  H01F27/24 ,  H01F27/28 ,  H01F41/04

Abstract: A coil component includes a body having both end surfaces opposing each other in a length direction; a support substrate disposed in the body; a coil portion disposed on the support substrate in a width direction of the body, and including first and second lead-out portions each exposed to a first surface and a second surface of the body opposing each other in a thickness direction of the body, respectively, and disposed on the support substrate; and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, and connected to one ends of the first and second lead-out portions exposed to the first surface of the body, respectively.

公开(公告)号：US09899143B2

公开(公告)日：2018-02-20

申请号：US15339622

申请日：2016-10-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Hee Kim ,  Tae Young Kim ,  Myoung Soon Park ,  Sung Hyun Kim ,  Hye Yeon Cha

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/32 ,  H01F17/00 ,  H01F27/29 ,  H01F41/04 ,  H01F41/12 ,  H01F17/04

CPC classification number: H01F27/327 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F41/042 ,  H01F41/046 ,  H01F41/127 ,  H01F2017/048

Abstract: The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.

公开(公告)号：US12224102B2

公开(公告)日：2025-02-11

申请号：US17224572

申请日：2021-04-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han Kyeol Kim ,  Myoung Soon Park ,  Sung Hee Kim ,  Ji Young Park

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/255 ,  H01F27/29 ,  H01F41/04

Abstract: A coil component includes: a body; a support substrate disposed in the body; a coil portion including coil patterns, lead patterns, and extension patterns, while disposed on the support substrate, the lead patterns being exposed to the body, and the extension patterns connecting the coil patterns and the lead patterns; and external electrodes disposed on the body and contacting the lead patterns, wherein the lead pattern has an inner portion adjacent to the extension pattern, an outer portion adjacent to the external electrode, and a middle portion disposed between the inner portion and the outer portion, and a width of the middle portion is larger than a width of the inner portion and smaller than a width of the outer portion.

公开(公告)号：US12014860B2

公开(公告)日：2024-06-18

申请号：US17230461

申请日：2021-04-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myoung Soon Park ,  Sung Hee Kim ,  Han Kyeol Kim ,  Ji Young Park

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F27/33 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F27/323 ,  H01F27/33 ,  H01F41/041

Abstract: A coil component includes: a body; an insulating layer disposed in the body; a coil portion including a first coil pattern embedded in the insulating layer and having a first surface exposed to a first surface of the insulating layer and a second coil pattern disposed on a second surface of the insulating layer, facing the first surface of the insulating layer; and a noise removing portion disposed in the insulating layer and spaced apart from the first and second coil patterns, respectively.

公开(公告)号：US10515752B2

公开(公告)日：2019-12-24

申请号：US15386098

申请日：2016-12-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Woon Chul Choi ,  Ji Hye Oh ,  Sung Hee Kim ,  Jung Hyuk Jung

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/245 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12 ,  H01F17/00 ,  H01F17/04

Abstract: A thin film inductor includes a body including a coil part disposed therein, wherein the coil part includes a patterned insulating film disposed on a substrate and a coil pattern formed between the patterned insulating films, the coil pattern having a lower height than the insulating film, such that the coil pattern may be formed in a structure with a high aspect ratio while having a uniform thickness, thereby increasing a cross-sectional area of the coil part and improving direct current resistance (Rdc) characteristics.

公开(公告)号：US11742136B2

公开(公告)日：2023-08-29

申请号：US16919613

申请日：2020-07-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Sun Kim ,  Sung Hee Kim ,  In Suk Kim

IPC: H01F27/36 ,  H01F27/24 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

CPC classification number: H01F27/36 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/324 ,  H01F41/041 ,  H01F41/12 ,  H01F2027/2809

Abstract: A coil component includes a support substrate including a through-hole disposed therein; a body including the support substrate embedded therein, and having a core disposed in the through-hole of the support substrate; a coil portion disposed on the support substrate, embedded in the body, and having a plurality of turns with reference to the core as an axis on the support substrate; and a shielding pattern disposed between an internal wall of the support substrate, by which the through-hole is defined, and the core.

公开(公告)号：US20220172885A1

公开(公告)日：2022-06-02

申请号：US17164034

申请日：2021-02-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Young Park ,  Myoung Soon Park ,  Sung Hee Kim ,  Han Kyeol Kim

IPC: H01F27/29 ,  H01F17/00 ,  H01F27/32

Abstract: A coil component includes a support substrate disposed in the body, a coil portion disposed on the support substrate and comprising first, second, third and fourth coil layers spaced apart from each other, and a first external electrode and a second external electrode disposed to be spaced apart from each other on the body and connected to the first and fourth coil layers, respectively. Each of the second and third coil layers comprises a first metal layer, disposed on the support substrate, and a second metal layer disposed on the first metal layer to cover a side surface of the first metal layer and to be in contact with the support substrate. The second coil layer has a first bridge pattern exposed to a first side surface of two side surfaces, opposing each other, of the body. The third coil layer has a second bridge pattern exposed to a second side surface of the two side surfaces of the body.

公开(公告)号：US20180211762A1

公开(公告)日：2018-07-26

申请号：US15786138

申请日：2017-10-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Hyuk Jung ,  Sung Hee Kim ,  Hye Yeon Cha

IPC: H01F27/28 ,  H01F41/04 ,  H01F27/29 ,  H01F1/153 ,  H01F27/24

CPC classification number: H01F27/2804 ,  H01F1/153 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/24 ,  H01F27/292 ,  H01F27/324 ,  H01F41/042 ,  H01F41/046 ,  H01F2017/048

Abstract: A coil component includes a body including a magnetic material, a support member disposed inside the body, and a coil pattern disposed on the support member inside the body. The coil pattern includes a first conductive layer, having a planar spiral shape, and a second conductive layer, having a line width greater than a thickness thereof, while covering the first conductive layer. When viewed from a surface of the body cut in thickness and width directions, a line width of each of outermost and innermost patterns of the first conductive layer is different from a line width of at least one internal pattern disposed between the outermost and innermost patterns.